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Used Semiconductor and PCB Manufacturing

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Wafer Size 300 mm Fab Section Defect Detection General Product Information Vendor Supplier AMAT Model UVision Year(s) : 2014 Location : United States (USA)

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Wafer Size 200 mm Fab Section Implant General Product Information Software Version 13.42.18 CIM GEM and SECS Year(s) : 2007 Location : United States (USA)

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Wafer Size 300 mm Fab Section Lab General Product Information Vendor Supplier FEI Model FEI ExSolve CLM Next Year(s) : 2016 Location : United States (USA)

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Wafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier Fusion Semiconductor Model 20 Year(s) : 1993 Location : United States (USA)

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Wafer Size 200 mm Fab Section Etch General Product Information Vendor Supplier GASONICS INTERNATIONAL Model P Year(s) : 2000 Location : United States (USA)

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Wafer Size 300 mm Fab Section Support Tools General Product Information Vendor Supplier BROOKS Model EUV Reti Year(s) : 2017 Location : United States (USA)

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Fab Section Failure Analysis General Product Information Vendor Supplier BRUKER Model D8 Davinci Vintage 2013 Year(s) : 2013 Location : United States (USA)

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Wafer Size 300 mm Fab Section Defect Detection General Product Information Vendor Supplier AMAT Model UVISION Year(s) : 2013 Location : United States (USA)

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Wafer Size 200 mm Fab Section Diffusion General Product Information Vendor Supplier TOKYO ELECTRON LIMITED Mo Year(s) : 1995 Location : United States (USA)

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Wafer Size 200 mm Fab Section Diffusion General Product Information Vendor Supplier TOKYO ELECTRON LIMITED Mo Year(s) : 1996 Location : United States (USA)

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Wafer Size 200 mm Fab Section Diffusion General Product Information Vendor Supplier TOKYO ELECTRON LIMITED Mo Year(s) : 1993 Location : United States (USA)

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Wafer Size 300 mm Fab Section Support Tools General Product Information Vendor Supplier DESPATCH Model PWB-48 Year(s) : 2011 Location : United States (USA)

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Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier KLA Model Archer A500 AIM Year(s) : 2014 Location : United States (USA)

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Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier KLA-TENCOR Model EDR 5210 Year(s) : 2010 Location : United States (USA)

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Wafer Size 200 mm Fab Section Thin Film General Product Information Vendor Supplier Lam Research Model Novell Year(s) : 2000 Location : United States (USA)

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Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier BRUKER Model D8 Fabline V Year(s) : 2014 Location : United States (USA)

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Wafer Size 200 mm Fab Section Thin Film General Product Information Vendor Supplier Lam Research Model Novell Year(s) : 2000 Location : United States (USA)

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Wafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier CFM Model FullFlow 1/99 8100 Year(s) : 1999 Location : United States (USA)

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Wafer Size 200 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model ENDURA P5500 V Year(s) : 2000 Location : United States (USA)

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Wafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier CFM Model FullFlow 1/99 8100 Year(s) : 1999 Location : United States (USA)

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Wafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model Producer SE Vi Year(s) : 2011 Location : United States (USA)

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OP2600DUVI, 200mm, s/n: 6454 Year(s) : 1997 Location : United States (USA)

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OP3260I, 200mm, s/n: 6678 Year(s) : 1998 Location : United States (USA)

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Scanning Electron Microscopes Year(s) : 2008 Location : United States (USA)

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EDR 5210, 300mm, s/n: 5040135 Year(s) : 2010 Location : United States (USA)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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