Used Semiconductor and PCB Manufacturing
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200mm, s/n: 97-46-5419 Year(s) : 2000 Location : United States (USA)
Price : On request
More details200mm, s/n: 1080 Location : United States (USA)
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More detailsION IMPLANTATION SYSTEM Year(s) : 1998 Location : United States (USA)
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More detailsGeneral Product Information Vendor Supplier MATTSON TECHNOLOGY Model ASPEN 2 Vintage 1999 Asset Description MA Year(s) : 1999 Location : United States (USA)
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More detailsGeneral Product Information Vendor Supplier DISCO Model DGP8761/Type DP Vintage 2012 Asset Description BSG900- Year(s) : 2012 Location : United States (USA)
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More detailsGeneral Product Information Vendor Supplier Applied Material Model Quantum Leap II Vintage 2002 Asset Descript Year(s) : 2002 Location : United States (USA)
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More detailsGeneral Product Information Vendor Supplier LINTECH Model RAD-3510F/12 Vintage 2012 Asset Description BSL900-T Year(s) : 2012 Location : United States (USA)
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More detailsTransaction Information Tool ID OP 922 Tool Status Connected Wafer Size 300 mm Fab Section Defect Detection Year(s) : 2007 Location : United States (USA)
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More detailsVendor Supplier DISCO Model DGP8761/Type DP Vintage 2018 Asset Description BSG903U1-TR DISCO DFM2800 Fully au Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Clean General Product Information Vendor Supplier SCREEN/DNS Model SU-3200 Vint Year(s) : 2012 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier AMAT Model Verity1 SEM Vi Year(s) : 2005 Location : United States (USA)
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More detailsBRUSH CLEANER Year(s) : 2012 Location : United States (USA)
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More details5200, 200mm, s/n: 2070 Year(s) : 2000 Location : United States (USA)
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More detailsRaider ECD310 Year(s) : 2006 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Diffusion General Product Information Vendor Supplier APPLIED MATERIALS Model C Year(s) : 2006 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model FRONTIER - Etc Year(s) : 2015 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier HSEB (now Unity SC) Model Year(s) : 2007 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Etch General Product Information Vendor Supplier LAM Model 9600 BRME Vintage 19 Year(s) : 1998 Location : United States (USA)
Price : On request
More detailsTool Status Disconnected Wafer Size 300 mm Fab Section Support Tools General Product Information Vendor Suppl Year(s) : 2009 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Thin Film Asset Description THK2550-T - THK2550FP RUDOLPH S3000S (MT) Software Year(s) : 2011 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Metrology General Product Information Vendor Supplier KLA Tencor Model AIT II V Year(s) : 2000 Location : United States (USA)
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More detailsAIT, 200mm, s/n: 0597-8087 Location : United States (USA)
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More details200mm, s/n: 9152 AIT II w/ ADC. Defect Inspection Year(s) : 2000 Location : United States (USA)
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More detailsAIT II, 200mm, s/n: 9262 Year(s) : 2009 Location : United States (USA)
Price : On request
More details300mm, s/n: 3800MN -105949 Tool ID: KW03 Year(s) : 2011 Location : United States (USA)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14