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Used Semiconductor and PCB Manufacturing

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1

West Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Location : AMERICA North (USA-Canada-Mexico)

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Tenney T10RC-1.5 Ultra Low Temperature Environmental Test Chamber. Digital programmable ramping Watlow F4 con Location : AMERICA North (USA-Canada-Mexico)

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TENNEY T20RC 2.0 Temperature Humidity Chamber. Digital programmable Color LDC screen controller with real tim Location : AMERICA North (USA-Canada-Mexico)

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Transferring die from sawn wafer (mounted frame) to tape and reel. Power Requirements 115 V 12.5 A Year o Year(s) : 1998 Location : EUROPE (Western and Northern)

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Semi auto wafer mounter to mount dicing tape and backgrind tape. Condition Excellent Year(s) : 2011 Location : EUROPE (Western and Northern)

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DESPATCH CURING OVEN Year of Manufacture 2016 Condition Good Year(s) : 2016 Location : EUROPE (Western and Northern)

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HIO process , 200mm, S/N M860260 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Wet Process Equipment 200mm Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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AOI for rigid panel or flex reel to reel feed, rigid panels max panel size 515mm x 515mm. Year(s) : 2019 Location : EUROPE (Western and Northern)

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Condition Refurbished Heated bondhead Wafer strecher Flip unit Tool bank Year(s) : 2012 Location : EUROPE (Western and Northern)

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Still installed - Warm shutdown. Working Condition. Wafer : 8 Inches. Vintage : 2008. It's complete with HDD a Year(s) : 2008 Location : EUROPE (Western and Northern)

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- Type II - EDX 1) Performance Resolution: - 1.5 nm guaranteed (at accelerating voltage 15 kV, working distan Year(s) : 1997 Location : EUROPE (Western and Northern)

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Clean Room Equipment Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

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[Specifications] - Convection method: Forced convection - Temperature setting range: -10℃ to +60℃* - Refrigera Location : ASIA (North East)

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[Specifications] Year 2016 Observation window Yes Temperature range -40 to +100℃ (minimum temperature reached Year(s) : 2016 Location : ASIA (North East)

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Plasma Processing Equipment and Tools, 200mm, s/n: 3715 Year(s) : 1996 Location : AMERICA North (USA-Canada-Mexico)

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[Specifications] Power supply 200V 3φ 60Hz MAX60A Condensation method Air cooling Operating time Approximatel Year(s) : 2018 Location : ASIA (North East)

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Vitronics Soltec Delta wave 6622-CC in Excellent condition Vintage 1999 Features: Flexible Preheat configurat Year(s) : 1999 Location : EUROPE (Western and Northern)

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Electrovert Omniflo 7 in Excellent conditie. Vintage: 2002 Features: - Seven (7) heating zones (seven top an Year(s) : 2002 Location : EUROPE (Western and Northern)

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IEMME Plus 20 N2 in excellent condition. Vintage: 2011 Features: Convection oven with air or nitrogen with 20 Year(s) : 2011 Location : EUROPE (Western and Northern)

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Critical Dimension Scanning Electron Microscopes, 300mm, s/n: U-666 Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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Chemical Vapor Deposition Equipment 300mm Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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DESPATCH INK CURE BAKE OVEN Maximum Temperature 260 ºC (500 ºF, 533 ºK) Power Requirements 220 V 22.7 Year(s) : 2005 Location : EUROPE (Western and Northern)

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Accessories 3 monitors Condition Good Year of Manufacture 2008 Year(s) : 2008 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Process Capabilities 4 Chamber Sys Year(s) : 2004 Location : EUROPE (Western and Northern)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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