Used Semiconductor and PCB Manufacturing
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WAH HUP HONG OVEN PHASE 400V Year(s) : 2000 Location : United States (USA)
Price : On request
More detailsPRI STOCKER Year(s) : 1999 Location : United States (USA)
Price : On request
More detailsWafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier KLA Singapore Model AITXU Year(s) : 2006 Location : United States (USA)
Price : On request
More detailsTransaction Information Tool Status Disconnected Wafer Size 300 mm Fab Section Metrology General Product Info Year(s) : 2005 Location : United States (USA)
Price : On request
More detailsTransaction Information Tool ID YDFI735 Tool Status Disconnected Wafer Size 300 mm Fab Section Metrology Gene Year(s) : 2005 Location : United States (USA)
Price : On request
More detailsTool ID YEBI731 (F7 YEBI703) Tool Status Connected Wafer Size 300 mm Fab Section Defect Detection General Pro Year(s) : 2006 Location : United States (USA)
Price : On request
More detailsTool ID ASMS707 Tool Status Disconnected Wafer Size 300 mm Fab Section Material Handling Tool Available Date 2 Year(s) : 2005 Location : United States (USA)
Price : On request
More detailsWafer Size 200 mm Fab Section Diffusion General Product Information Vendor Supplier TEL Model TEL ALPHA 8S Vi Year(s) : 1996 Location : United States (USA)
Price : On request
More detailsTool ID DFN-01 Tool Status Connected Wafer Size 200 mm Fab Section Diffusion General Product Information Vend Year(s) : 1994 Location : United States (USA)
Price : On request
More detailsTool ID DF-OHT-02 Wafer Size 300 mm Fab Section Diffusion General Product Information Vendor Supplier TEL Mod Year(s) : 2006 Location : United States (USA)
Price : On request
More detailsTool ID DF-PLD-07 Wafer Size 300 mm Fab Section Diffusion General Product Information Vendor Supplier TEL Mod Year(s) : 1999 Location : United States (USA)
Price : On request
More detailsTool ID POCL3-01 Tool Status Connected Wafer Size 200 mm Fab Section Diffusion General Product Information Ve Year(s) : 1995 Location : United States (USA)
Price : On request
More detailsTool ID BDOPE-01 Tool Status Connected Wafer Size 200 mm Fab Section Diffusion General Product Information Ve Year(s) : 2000 Location : United States (USA)
Price : On request
More detailsPlasma Processing Equipment and Tools Year(s) : 1999 Location : United States (USA)
Price : On request
More detailsOXIDE ETCHER Year(s) : 1996 Location : United States (USA)
Price : On request
More detailsTool ID CVQBD-02 Tool Status Connected Wafer Size 200 mm Asset Description MDC FOR GATE OXIDE ANALYSIS Softwar Year(s) : 2002 Location : United States (USA)
Price : On request
More detailsTool Status Disconnected Wafer Size 300 mm Fab Section Material Handling Year(s) : 2007 Location : United States (USA)
Price : On request
More detailsAMAT NanoSEM 3D, 300mm Year(s) : 2004 Location : United States (USA)
Price : On request
More detailsVertical Furnace (PYRO OXIDE) Year(s) : 1997 Location : United States (USA)
Price : On request
More detailsVertical Furnace (PYRO OXIDE) 200mm Year(s) : 1997 Location : United States (USA)
Price : On request
More detailsAST SUPER HEAT SYSTEM 200mm Year(s) : 1999 Location : United States (USA)
Price : On request
More detailsTCDEV-26 TEL ACT 8 COATER/DEVELOPER (ex CTDV-A19) Year(s) : 2000 Location : United States (USA)
Price : On request
More detailsTCDEV-30 TEL ACT 8 COATER/DEVELOPER(former CTDV-A17) TEL ACT8, 200mm Year(s) : 1999 Location : United States (USA)
Price : On request
More detailsTRACK TEL ACT8 200mm Location : United States (USA)
Price : On request
More details200mm TCDEV-24 JUSTIN ACT TRACK FOR 0.25um (former TCDEV-39) Year(s) : 2000 Location : United States (USA)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14