Used Semiconductor and PCB Manufacturing
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Wafer Size 300 mm Fab Section Diffusion General Product Information Vendor Supplier APPLIED MATERIALS Model C Year(s) : 2006 Location : United States (USA)
Price : On request
More detailsWafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model FRONTIER - Etc Year(s) : 2015 Location : United States (USA)
Price : On request
More detailsWafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier HSEB (now Unity SC) Model Year(s) : 2007 Location : United States (USA)
Price : On request
More detailsWafer Size 200 mm Fab Section Etch General Product Information Vendor Supplier LAM Model 9600 BRME Vintage 19 Year(s) : 1998 Location : United States (USA)
Price : On request
More detailsTool Status Disconnected Wafer Size 300 mm Fab Section Support Tools General Product Information Vendor Suppl Year(s) : 2009 Location : United States (USA)
Price : On request
More detailsWafer Size 300 mm Fab Section Thin Film Asset Description THK2550-T - THK2550FP RUDOLPH S3000S (MT) Software Year(s) : 2011 Location : United States (USA)
Price : On request
More detailsWafer Size 200 mm Fab Section Metrology General Product Information Vendor Supplier KLA Tencor Model AIT II V Year(s) : 2000 Location : United States (USA)
Price : On request
More detailsAIT, 200mm, s/n: 0597-8087 Location : United States (USA)
Price : On request
More details200mm, s/n: 9152 AIT II w/ ADC. Defect Inspection Year(s) : 2000 Location : United States (USA)
Price : On request
More detailsAIT II, 200mm, s/n: 9262 Year(s) : 2009 Location : United States (USA)
Price : On request
More details300mm, s/n: 3800MN -105949 Tool ID: KW03 Year(s) : 2011 Location : United States (USA)
Price : On request
More detailsWET SCRUBBER/BRUSH CLEANER Year(s) : 2012 Location : United States (USA)
Price : On request
More detailsHigh Resolution Rutherford Backscattering Tool ID: MAL2580 Year(s) : 2013 Location : United States (USA)
Price : On request
More detailsSPEED, 300mm, s/n: 03-9-C30214 300MM WTS with 2 HDP STI oxide chambers Tool ID: JID1 Year(s) : 2003 Location : United States (USA)
Price : On request
More detailsVertical LPCVD Furnaces Year(s) : 2015 Location : United States (USA)
Price : On request
More detailsChemical Vapor Deposition Equipment Year(s) : 2017 Location : United States (USA)
Price : On request
More detailsAPPLIED MATERIALS DPS POLY ETCHER Tool ID: POLY-A08 Year(s) : 1998 Location : United States (USA)
Price : On request
More detailsSPECTRACD-XT, 300mm, s/n: 6511267 Year(s) : 2009 Location : United States (USA)
Price : On request
More detailsPlasma Processing Equipment and Tools Year(s) : 2004 Location : United States (USA)
Price : On request
More details200mm, s/n: 8181620 Tool ID: SOGCT-05 Year(s) : 1998 Location : United States (USA)
Price : On request
More detailsCentura TPCC XE+ RP AB: Gate-ox (DPN+RTO);C:Singen Spacer Year(s) : 2000 Location : United States (USA)
Price : On request
More details3 Chamber System with 2 Year(s) : 1996 Location : United States (USA)
Price : On request
More detailsFSICL MECURRY PROCESS Year(s) : 2015 Location : United States (USA)
Price : On request
More detailsTRF6 HIMS-A01-T RETICLE MACRO INSPECTION TOOL(EVAL TOOL) (former LRIS-02) Year(s) : 2006 Location : United States (USA)
Price : On request
More detailsKLA AITXUV, 300mm, s/n: UV1005R Year(s) : 2006 Location : United States (USA)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14