FEI ExSolve CLM next Gen

Wafer Size 300 mm
Fab Section Lab

General Product Information
Vendor Supplier FEI
Model FEI ExSolve CLM Next Gen
CIM Factory Automation Available
Process FIB – cut samples from wafers in line

Hardware Confguration (Fab)
Main System FEI ExSolve G2 Full Wafer TEM
Prepartion System 1
Factory Interface SMIF 1
Handler System Brooks Front End 1
Options System GIS, Dep 5

Hardware Confguration (Subfab / Auxilliary Units)
TMC Table and Edwards XDS35
Dry Pumps 3