FEI ExSolve CLM next Gen

Wafer Size 300 mm
Fab Section Lab

General Product Information
Vendor Supplier FEI
Model FEI ExSolve CLM next Gen
Vintage 2015
Process Cut samples from wafers in line

Hardware Confguration (Fab)
System Type Description Quantity Status
Handler System Brooks Front End 1
Options System Gas Injection System (GIS) Module,
C-Dep (SEM),Ins-Dep (SEM),W-Dep
(SEM), W-Dep, C-Dep 5
Main System FEI ExSolve G2 Full Wafer TEM
Preparation System 1
Factory Interface SMIF 1

Hardware Confguration (Subfab / Auxilliary Units)
TMC Vibration Isolation Table, Edwards XDS35
Dry Pumps 3

Missing/Faulty Parts / Accesorries List
Front End Flash
Drive Failure, tool is down 1

Tool Pictures
General FEI ExSolve G2 Full Wafer TEM
Preparation System