Used Semiconductor and PCB Manufacturing
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Wafer Size 300 mm Fab Section Lithography General Product Information Vendor Supplier TEL Model LITHIUS Vinta Year(s) : 2005 Location : United States (USA)
Price : On request
More detailsWafer Size 300 mm Fab Section Clean General Product Information Vendor Supplier DNS Model FC-3100 Vintage 200 Year(s) : 2007 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Lithography General Product Information Vendor Supplier ASML Model NXT1950i Vin Year(s) : 2011 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Lithography General Product Information Vendor Supplier ASML Model XT1400E Vint Year(s) : 2007 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Lithography General Product Information Vendor Supplier ASML Model XT1900Gi Vin Year(s) : 2008 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Test General Product Information Vendor Supplier TEL Model P12XL Prober Vintage Year(s) : 2002 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Lithography General Product Information Vendor Supplier TEL Model LITHIUS Vinta Year(s) : 2006 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Test General Product Information Vendor Supplier TEL Model P8 Vintage 1995 Asse Year(s) : 1995 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Lithography General Product Information Vendor Supplier TEL Model LITHIUS Vinta Year(s) : 2006 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Etch General Product Information Vendor Supplier TOKYO ELECTRON LTD Model U2E-8 Year(s) : 1997 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Etch General Product Information Vendor Supplier LAM Model 2300 Exelan Flex Vin Year(s) : 2006 Location : United States (USA)
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More detailsLithography Equipment 300mm Year(s) : 2011 Location : United States (USA)
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More details300mm, s/n: 0030 Lithography Equipment Year(s) : 2017 Location : United States (USA)
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More details300mm, s/n: M872, Microscope Inspection Items Year(s) : 2011 Location : United States (USA)
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More detailsTest & Measurement Year(s) : 2001 Location : United States (USA)
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More detailsTest & Measurement Year(s) : 2001 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Lithography General Product Information Vendor Supplier TOKYO ELECTRON LIMITED Year(s) : 2015 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Diffusion General Product Information Vendor Supplier Tokyo Electron Limited Mo Year(s) : 1996 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Etch General Product Information Vendor Supplier AME Model AMAT 5200 Centura 1 Year(s) : 1999 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Lithography General Product Information Vendor Supplier NIKON Model NSR-208D Vi Year(s) : 2008 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier Robotics Vision Systems i Year(s) : 2003 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Diffusion General Product Information Vendor Supplier Tokyo Electron Limited Mo Year(s) : 1996 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier UNAXIS Model Oerlikon Una Year(s) : 2006 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Diffusion General Product Information Vendor Supplier TOKYO ELECTRON LIMITED Mo Year(s) : 2004 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Diffusion General Product Information Vendor Supplier HITACHI KOKUSAI Model DJ- Year(s) : 2015 Location : United States (USA)
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More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14