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Used Semiconductor Equipment

3,424 results
1

Microscope Configuration Brightfield & Darkfield Illumination Type Reflected Light Binocular Angle 45° Eye Location : AMERICA North (USA-Canada-Mexico)

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Exterior Dimensions Width 15.750 in (40.0 cm) Depth 13.750 in (34.9 cm) Height 17.000 in (43. Location : AMERICA North (USA-Canada-Mexico)

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Description Portable Pressure Transfer Standard Pressure Range 10.00 torr (13.33 mbar) Other Information Location : AMERICA North (USA-Canada-Mexico)

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Model U-SWH 10x.26.5 Magnification 10 X Field Number 26 mm Focusing YES Trinocular/Phototube Provide Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 200 mm Number of Chambers 1 Process Capabil Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Formerly item 860 Olympus BH series microscope Objectives: 10X, 40X, 100X Reflected and transmitted light Eye Year(s) : 1980 Location : AMERICA North (USA-Canada-Mexico)

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Description Portable Pressure Transfer Standard Pressure Range 10.00 torr (13.33 mbar) Other Information Location : AMERICA North (USA-Canada-Mexico)

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Rated Power Output 1000 Watts Chamber Construction Aluminum/box Chamber Size Width 13.00 in (33.02 cm Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Compound Multiple Objectives Models American Optical Microscope Objectives: 4/.12 Plan ach Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 150 mm Microscope Type Microzoom X-Y Optics Motion YES Vacuum Chuck Diamet Location : AMERICA North (USA-Canada-Mexico)

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Features: Flexible range. Capable of 1 to 100W operation Greater stability Reproducible conditions Location : AMERICA North (USA-Canada-Mexico)

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Etcher Type Barrel Rated Power Output 600 Watts Reactor Center Cylindrical Reactor Center Size Depth 1 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Number of Photoresist Develop Stations 1 Number of Phot Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Specifications: Resolution: 1µm Full range accuracy (at 20°C): 3µm over 25mm Max allowable preset value: Location : AMERICA North (USA-Canada-Mexico)

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Description: Other Information Wafer Size: 4 to 8" Tape Tension: Programmable Cycle Time: 30 seconds for a 6 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System Cryo Pumped Load Lock Included No E Beam Power Supply Power Supply Type Solid State Hig Location : AMERICA North (USA-Canada-Mexico)

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Description High Volume Evaporator Vacuum System Cryo Pumped Load Lock Included No E Beam Power Supply Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 100 mm Set Size 100 mm Other Information Chucks:2"-3"-4" Po Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System Cryo Pumped Load Lock Included Yes Number of RF Etch Cathodes 1 Substrate Heaters Yes Residu Location : AMERICA North (USA-Canada-Mexico)

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Description PECVD TEOS with Load Lock Wafer Size Range Maximum 200 mm Process PECVD & TEOS Controller T Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 200 mm Process PECVD/Plasma Etch/Reactive Ion Etch Controller Type Microproces Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 100 mm Mask Plate Size 5'' x 5'' Alignment Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Rated Power Output 1250 Watts Chamber Construction Aluminum Chamber Size Width 14.75 in (37.47 cm) Location : AMERICA North (USA-Canada-Mexico)

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8300 Weight 36 lb (16 kg) Location : AMERICA North (USA-Canada-Mexico)

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Eutectic Die Attach System Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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