Surface Technology Systems (STS) 308 PC

Etcher Type Barrel
Rated Power Output 600 Watts
Reactor Center Cylindrical
Reactor Center Size
Depth 10.00 in (25.40 cm)
Reactor Center Material Aluminum
Automatching Network Included Yes
Vacuum Pump Included Yes
Vacuum Pump Model Leybold D65BCS
RF Generator Model ENI AGC-6B
Other Information Capacity:
100 of 100mm wafers
50 of 150mm wafers
Process gas: O2, 10% H2/N2
Pressure range: 0 to 2 Torr

Pump PFPE prepped
Computer/monitor Plasma power: 600 Watt
Chamber heat
Power Requirements 208 V 25.0 A 50/60 Hz 3 Phase
CE Marked YES
Exterior Dimensions
Width 21.000 in (53.3 cm)
Depth 32.000 in (81.3 cm)
Height 65.000 in (165.1 cm)