Trion Oracle

Wafer Size Range
Minimum 50 mm
Maximum 200 mm
Set Size 200 mm
Number of Chambers 1
Process Capabilities Oxide Etch
Chamber 1 Description

RIE Dielectric Etch
Phantom III RIE Reactor
Controller Type PC Controller Type
Elevator Type Brooks Automation VCE 6
Process Gases CF4, CHF3, Ar, O2
Other Information

Central Vacuum
Transport (CVT) Platform
High Conductance Plenum and Vacuum System
Manual Wafer Load Port
Automatic Pressure Control
600 Watt, 13.56 MHz RF Generator
DC Bias Control
Brooks Automation VCE6 Vacuum Cassette Elevator
(2) Ebara ESR20N 2,000 LPM Dry Pumps,
Power Requirements 208 V 49.0 A 60 Hz 3 Phase