Used Semiconductor Equipment

Deep Silicon Etcher Version: 4,6 and 8 inch Vintage: 01.06.2012 Plasma-Therm Versaline DSE-III (Deep Silicon Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Liquid resin Model, very low use time Location : EUROPE (Western and Northern)

Price : On request

Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Chambers 2 Controller Typ Location : AMERICA North (USA-Canada-Mexico)

Price : On request

[Specifications] ○Measurement unit: XM-1200 ○Controller: XM-1500 ○Measurement range: 600mm x 300mm x 200mm ○Im Location : ASIA (North East)

Price : On request

Wafer Size Range Minimum 200 mm Maximum 200 mm Condition Good CE Marked YES Exterior Dimensions Year(s) : 1995 Location : EUROPE (Western and Northern)

Price : On request

The MEl 829Z is a thermosonic ball bonder with manual Z lever and heated work holder. Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Mask Aligner With 150mm Backside Chuck Cassette to Cassette 1000 Watt Light Source Location : AMERICA North (USA-Canada-Mexico)

Price : On request

10″ COLLIMATED LENS FOR UP TO 6X6″ SQUARES OR 200mm WAFERS DUAL VIDEO CAMERAS ABOVE AND BELOW MASK 500 WATT P Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Used, looks complete, very clean Manufacturer ALSI Model DCM802 Laser Separation System w/ LCPU, Wafer Location : EUROPE (Western and Northern)

Price : On request

Used, complete, very clean Brand NEL System NITTO MA-1508N Auto Wafer mounter, for 6 inch or 8 inch Wafer Location : EUROPE (Western and Northern)

Price : On request

Metal film measurement system Version: 150-200 mm Vintage: 01.06.2006 Condition: Good. Configuration notes: MP Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Cryo Compressor - Vacuum Pump Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Stepper Model 1600 Year(s) : 2001 Location : EUROPE (Western and Northern)

Price : On request

Precision dicing saw SEM and TEM Location : EUROPE (Western and Northern)

Price : On request

NOVELLUS, INOVA NEXT, 300mm Tool ID: MDX2951 Year(s) : 2013 Location : EUROPE (Western and Northern)

Price : On request

Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bondin Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Thin film measurement tool Broadband UV optics Dual beam spectrophotometry Wafer sizes: 100mm, 150mm, and 200m Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Manual wafer load substrate bonder Set up for fusion compression bonding, thermal compression bonding, and an Location : AMERICA North (USA-Canada-Mexico)

Price : On request

The Oxford Plasmalab 100 is a modular plasma processing system. It can be configured to carry out Reactive I Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer sorter for 300mm wafer Version: 300mm De-installed, warehoused. Can be inspected by appointment. 2 port Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Mask Aligner with CIC1000 lamp housing Version: 200 mm The machine was in working condition up until it was Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

FEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)

Price : On request

552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)

Price : On request

572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Model 365 Capabilities: Cures most UV tape in 5 seconds Large exposure area cures up to 300mm wafers. Location : AMERICA North (USA-Canada-Mexico)

Price : On request