EVG 520IS Wafer Bonder

Manual wafer load substrate bonder
Capable of fusion compression bonding
Capable of thermal compression bonding
Capable of anodic bonding (optional)
Ideal for R&D and pilot production applications
High-vacuum capable bond chamber
Auto opening of bond tool cover
Windows based control software and operation interface
Wafer size: up to 6"/150mm capable
Max Bond Force: 60 kN
Top side heater: 550°C max. in 1°C steps
Bottom side heater: 550°C max. in 1°C steps
Chiller
Temperature uniformity: ± 1,5 %
Turbo pump & controller
Roughing pump
Vintage 2008
System computer, monitor, and keyboard
PDF Operations Manual for EVG 520IS Bonder
Available for full inspection and demonstration
Installation, training, service and support available worldwide

CONDITION:
Excellent Condition Guaranteed.
Fully Refurbished to Factory Specifications.
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.