EVG 520 Bonder

Description:

-Tooling for 6" Wafer inclusive Bond Chuck and Pressure Insert
-Capable of fusion compression bonding
-Capable of thermal compression bonding
-Capable of anodic bonding
-Ideal for R&D and pilot production applications
-High-vacuum capable bond chamber
-Auto opening of bond tool cover
-Windows based control software and operation interface
-Wafer size: up to 150mm capable
-Max Bond Force: 7 kN
-Top side heater: 550°C max. in 1°C steps
-Bottom side heater: 550°C max. in 1°C steps
-Chiller
-Temperature uniformity: ± 1,5 %
-Turbo pump and controller
-Roughing pump
-Load/unload tool
-System computer, monitor, and keyboard
-PDF Operations Manual for EVG 520 Bonder