EVG 501 Wafer Bonder

EVG EV501 WAFER BONDER consisting of:
- Model: EVG 501
- Capable of thermo compression, fusion or
anodic wafer bonding
- Bond chamber for small pieces up to 150mm wafers
(with correct tooling)
- Thickness: Max wafer stack thickness 6mm
- Bottom side heater: 550°C max. in 1°C steps
- Temperature uniformity: ± 1,5 %
- Turbo Pump
- High voltage power supply for anodic bonding
(additional tooling may be required)
- Electronics Rack
- Computer & Software
- LCD Monitor
- Roughing Pump
- Operations Manual for EVG 501 Bonder
- Available for full inspection and demonstration
- Installation, training, service, and support available worldwide
for all our refurbished EVG Bonders!

CONDITION:
Excellent Condition Guaranteed.
Fully Reconditioned to Factory Specifications.
3 Month Warranty and Full Specification Guarantee.
30 Day Right of Return.