EVG 520 Wafer Bonder

Manual wafer load substrate bonder
Set up for fusion compression bonding,
thermal compression bonding, and anodic bonding
Ideal for R&D and pilot production applications
High-vacuum capable bond chamber
Auto opening of bond tool cover
Windows based control software and operation interface
Wafer size: up to 200mm capable
Includes quartz pressure insert, contact electrode,
graphite electrode, and bond glass.
High Voltage Power Supply
Max Bond Force: 10 kN
Top side heater: 550°C max. in 1°C steps
Bottom side heater: 550°C max. in 1°C steps
Chiller
Temperature uniformity: ± 1,5 %
Roughing pump
Load/unload tool
System computer, monitor, and keyboard
Operations Manual for EVG 520 Bonder
Available for full inspection and demonstration

CONDITION:
Excellent Condition Guaranteed.
Fully Refurbished to Factory Specifications by ClassOne.
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.