Oxford Plasmalab 100

The Oxford Plasmalab 100 is a
modular plasma processing system.
It can be configured to carry out Reactive Ion Etching (RIE),
Plasma Enhanced Chemical Vapour Deposition (PECVD) and
Inductively Coupled Plasma (ICP) processes.
The system can be tailored to suit different rates of
throughput using transfer and load lock chambers with
manual or automatic loading.
Combinations of processes can be achieved by
using a transfer chamber robot to serve up to
four process chambers.

System Description:
-One Machine with 2 Process Modules and
one Square LoadLock in between,
-Left Chamber: PECVD (No turbo).
-Right Chamber ICP/RIE (with Turbo) and
ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6".
-LoadLock- Square with rotating arm.
-PLC are the original version of "Black" PLC.
-Computer Oxford Software Version-PC2000
-Also included: Mechanical Oil pump qty 3 Pumps.
-One Chiller attached to ICP/RIE
-2 Gas Pods:
PECVD- SiH4 (silane)
N2O
NH3 (ammonia)
Another 3 gas lines available (not in use now)
ICP/RIE-C4F8
O2
He
Another 1 gas line available (not in use now)
NOTE: The machine is complete, nothing is missing,
and it is ready to be installed and operated.