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Used Semiconductor Equipment

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1

Plasma Etch Version: 150 mm Vintage: 01.06.1995 The equipment was operational in the wafer fab up until Augus Year(s) : 1995 Location : AMERICA North (USA-Canada-Mexico)

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High Current Implanter Version: 200 mm SMIF Vintage: 01.12.2000 : Current Status of tool: In cleanroom, idled Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Version: 150 mm Vintage: 01.06.1992 The equipment was operational in the wafer fab up until August 2024. The Year(s) : 1992 Location : AMERICA North (USA-Canada-Mexico)

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OAI Model 806 MBA NUV 4" Mask Aligner is a four-camera, manual, optical backside mask aligner system that is d Location : AMERICA North (USA-Canada-Mexico)

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DOM 6/2017 Per the OEM: As the true 3D AOI system, ZENITH LiTE effectively measures solder joints and compo Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

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Manufacturer: ESEC Type: Smart Card Wire Bonder Model: ESEC 3100 SCplus Location : EUROPE (Western and Northern)

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ICP-PECVD deposition system for solar wafers Version: 156 mm square (200 mm) Vintage: 01.06.2015 PECVD deposi Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Condition: good Manufacturer Powatec Model Wafer Mounter Year(s) : 2000 Location : EUROPE (Western and Northern)

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6 inch vintage: 1995 As-is condition Complete with no missing parts Working condition before decommissioned P Year(s) : 1995 Location : EUROPE (Western and Northern)

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Tool Status Connected Wafer Size NA Fab Section Failure Analysis Asset Description Zeiss Merlin Scanning Ele Year(s) : 2010 Location : EUROPE (Western and Northern)

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Common Features of All 7500 Series Systems • Compact benchtop design permits easy integration into existing la Year(s) : 2010 Location : EUROPE (Western and Northern)

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CVD: MOCVD Location : ASIA (North East)

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Condition: good Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 76.3 Year(s) : 2004 Location : EUROPE (Western and Northern)

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Condition Refurbished S-1160B-4N Precision Manual Analytical Probe Station configured with 4" chuck upgradable Location : EUROPE (Western and Northern)

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Condition Good Exterior Dimensions Width 50.000 in (127.0 cm) Depth 86.614 in (220.0 cm) Height 74.0 Year(s) : 2004 Location : EUROPE (Western and Northern)

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Plasma Etch System: It uses a plasma-based process to selectively remove materials from the wafer surface, suc Location : AMERICA North (USA-Canada-Mexico)

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This West-Bond West-Bond 7372B Convertible Die Bonder can be converted between a 7200B Epoxy Die Bonder, and Location : EUROPE (Western and Northern)

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PECVD 80+ SiO2 Dep Non-functional tool but can be repaired (requires Silane MFC) Designed for 4” wafers but ca Location : EUROPE (Western and Northern)

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This West-bond 7400A Manual Ultrasonic/ Thermosonic 45° Feed Wedge-Wedge Wire Bonder looks to be in good cosm Location : EUROPE (Western and Northern)

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Brand: Manncorp Manncorp Sherlock-300B Batch AOI Machine Minimum PCB Size 2" x 3.15" (50 mm to 80 mm) Maximu Location : AMERICA North (USA-Canada-Mexico)

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Semi Auto wafer level Debonder Suitable for 200mm and 300mm Wafers. Year(s) : 2013 Location : EUROPE (Western and Northern)

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Bonder Model 7200 Year(s) : 2008 Location : EUROPE (Western and Northern)

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Three MaxumPlus Bonders upgraded by KNS from Maxum. Year(s) : 2004 Location : EUROPE (Western and Northern)

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1

Microscope autoloader only (Not including the microscope) Version: 100 MM AND 150 mm -Deinstalled to warehouse Location : AMERICA North (USA-Canada-Mexico)

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Large Area PECVD system, used for SiO and SiN process depositions Version: 150 mm Vintage: 01.06.2015 Plasmat Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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