Used Semiconductor Equipment

Manual wafer load substrate bonder Set up for fusion compression bonding, thermal compression bonding, and an Location : AMERICA North (USA-Canada-Mexico)

Price : On request

The Oxford Plasmalab 100 is a modular plasma processing system. It can be configured to carry out Reactive I Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer sorter for 300mm wafer Version: 300mm De-installed, warehoused. Can be inspected by appointment. 2 port Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Mask Aligner with CIC1000 lamp housing Version: 200 mm The machine was in working condition up until it was Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

FEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)

Price : On request

552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)

Price : On request

572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Model 365 Capabilities: Cures most UV tape in 5 seconds Large exposure area cures up to 300mm wafers. Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Polisher Grinder with Vector LC Power Head. Buehler Metaserv 3000 single plate automatic polishing machine wit Location : AMERICA North (USA-Canada-Mexico)

Price : On request

200mm TCDEV-24 JUSTIN ACT TRACK FOR 0.25um (former TCDEV-39) Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

WAFER SIZE 8" Type: Electroplating Model Number: R310PD2(1SA2CFD1CAP)08(CuNi)03 SYSTEM GENERAL CONFIGURATION 3 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

300mm DYD2 Tool ID: DYD2 Year(s) : 2005 Location : EUROPE (Western and Northern)

Price : On request

Cu Film thickness measurement Version: 300 mm Location : AMERICA North (USA-Canada-Mexico)

Price : On request

PVD cluster tool Version: 150 mm De-installed by the OEM . In working condition. Warehoused. Can be inspected Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Optical system: Fiber optic Detector: Semiconductor detector Burner head: Air-cooled titanium burner Nebulizer Year(s) : 2017 Location : ASIA (North East)

Price : On request

Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digital readout Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Thermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axi Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Double sided CO2 Laser marking system Brand HGTech Dual Headed system. Mark both sides in a single pass. High Year(s) : 2021 Location : EUROPE (Western and Northern)

Price : On request

CO2 In-Line PC Board Laser Marking System featuring: - 30-Watt CO2 Air-Cooled Laser - 16-Bit High-Precision Ga Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Mask and Wafer Inspection Loadport : 300mm x 2 Sets DualFIMS Working Condition. Wafer : 300 mm Complete. Year(s) : 2007 Location : ASIA (North East)

Price : On request

CO02 Amat Centura w SiCoNi 300 mm Year(s) : 2002 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

BKD4 Poongsan GENI HP Anneal High Pressure 300mm Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

FA02 TEL Telius Poly-T4 ATCC 300mm Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Rate Voltage: 220 VAC Rate Current: 10A Rate Frequency: 50 Hz Equipped with Panasonic Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

4KE Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Wire Bonder. All programmed bond v Location : AMERICA North (USA-Canada-Mexico)

Price : On request