4 Plasmatherm LAPECVD

Large Area PECVD system, used for SiO and SiN process depositions
Version: 150 mm
Vintage: 01.06.2015

Plasmatherm LAPECVD system
2x Loadlock ports,
2x Process chambers
and DMC/OCR reader
Set up for 150 mm wafer, but can do 100 mm and
200 mm with reconfiguration
Has CE Mark
Currently installed in the cleanroom and running wafers.
Can be inspected by appointment.
See photos for details of the current system condition.
The tool was used for silicon nitride as well as for
silicon oxide depositions, the latter being basically an
oxide with some fluor in it.
The size of the MFCs is to be found in the table below.
Some of the controllers can easily be reprogrammed to a
smaller range or configured for use of different gases if needed.
Both chambers of the tool were used for the same depositions. They are esentially identical, except the gas boxes,
where PM3 has one MFC less than PM2.

Manufacturing dates of the chambers:-
September 2014
July 2014
May 2016
October 2016
Available for immediate purchase and removal.

Generic system description:
LAPECVD™
Plasma-Therm’s LAPECVD™
(Large Area Plasma Enhanced Chemical Vapor Deposition)
uses a cassette-to-cassette configuration to allow for
high-volume production in a wide range of applications.
The LAPECVD™ platform can be used to deposit a variety of
thin-film materials with its parallel-plate plasma deposition system.

Hardware
Cassette-to-Cassette Handling
- Multi-substrate batch processing
Dual cassettes
Platen heating up to 350°C
Upper electrode RF power at 13.56 MHz with optional MFD
Up to 8 gas channels with digital MFCs
Thermally managed reactor design—up to 175°C for
internal walls and shower head
Endpoint
Integrated multifunctional endpoint capability with
EndpointWorks.
Unique OEI application for real-time film thickness and
rate monitoring.
OES for optimized chamber clean.

Software
User friendly software
Comprehensive data logging
Automated cleaning program
Real-time process data display
Fully integrated endpoint system
Factory automation compatible (SECS/GEM)
Edit recipes during runs
Multiple user access levels
Alarm history

Process
Stress control
High uniformity
Low damage
Low particulates
Tunable index
Increased productivity with batch loading capability
Low temperature