Singulus Singular XP

ICP-PECVD deposition system for solar wafers
Version: 156 mm square (200 mm)
Vintage: 01.06.2015

PECVD deposition system designed for coating of
crystalline silicon solar cells as an industrial production tool.
The SINGULAR XP ISE consists of
the following main components:
One IR heater station
Two ICP-PECVD stations for coating sunny side down with
integrated NF3 chamber cleaning by a
plasma etching process (Silane chambers)
Two ICP-PECVD stations for coating sunny side down with
mechanical chamber clean (Metal alkyl chambers)
The unique design permits that a minimum floor space is
required and allows an excellent maintenance and
service accessibility
Machine system components and automation modules are
proven and representing state of the art technology
Automatic, recipe controlled coating process
Nearly all handling actions are driven by AC-servo-drives
Conform to SEMI S2 standard, TÜV and CE marked
Selected components of the system:

2 x Edwards iXH 1820, each with its own power supply and
Profibus module d397-52-880 Issue C
1 x Edwards iXL 120 (turbomolecular pump)
8 x Edwards STP- iX3006C (turbomolecular pump)
4 x Edwards STP- 1003C (turbomolecular pump)

The system consists of two modules:
a) an automation module, which also contains all of
the system's control cabinets in an untouched state, and
b) process module consisting of a main vacuum chamber,
airlock, heating chamber and four process chambers.
These chambers are arranged in a star shape around an axis of
rotation and separated from each other by airlocks to
allow the sample trays to be transported in a
clockwise direction. The system was designed for
coating silicon samples (wafers) with dielectric layers and
amorphous silicon. It is designed for the processing of
wafers measuring 156 mm x 156 mm.
The square sample trays have four fields for
holding four wafers each.
The modules of the system have the following dimensions and
weights:

a) Automation module: l x w x h = 2.20 m x 2.35 m x 2.40 m,
weight approx. 1900 kg
The automation module is assigned 2 x pcs so- called
carrier-magazins for automatic loading and
unloading of wafers. These each have the following
dimensions: l x w x h = 1.42 m x 0.64 m x 1.70 m,
weight approx. 250 kg
b) Process module: l x w x h = 2.68 m x 3.20 m x 2.50 m,
weight approx. 5500 kg
So the total weight of the system is: approx. 7900 kg
This results in a total of 4 x pcs. Packages
The system is divided into these 4 x pcs. It is wrapped in
plastic foil and ready for loading in a heated warehouse
All gas pipes have been flushed with nitrogen before
dismantling. There are no trapped toxic or flammable gases in
pipe sections between valves.