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Used Wafer Equipment

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Microscope Type Compound Multiple Objectives Models American Optical Microscope Objectives: 4/.12 Plan ach Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 150 mm Microscope Type Microzoom X-Y Optics Motion YES Vacuum Chuck Diamet Location : AMERICA North (USA-Canada-Mexico)

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Description: Other Information Wafer Size: 4 to 8" Tape Tension: Programmable Cycle Time: 30 seconds for a 6 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 100 mm Set Size 100 mm Other Information Chucks:2"-3"-4" Po Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 100 mm Mask Plate Size 5'' x 5'' Alignment Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Upright Microscope Configuration Brightfield, Darkfield & DIC Illumination Type Reflected L Location : AMERICA North (USA-Canada-Mexico)

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Description Wafer Backlapping Film Applicator -- 6" Other Information Set up for 6" wafers Power Requiremen Location : AMERICA North (USA-Canada-Mexico)

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Diameter 6.0000 in (152.40 mm) Plating Material Nickel Number of Micropositioners 0 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Set Size 150 mm Microscope Type Stereo Zoom X-Y Optics Motion YES Vacuum Chuck Dia Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Stereo Zoom Vacuum Chuck Diameter 6.0000 in (152.40 mm) Plating Material Stainless Location : AMERICA North (USA-Canada-Mexico)

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Vacuum Chuck Diameter 5.9055 in (150.00 mm) Plating Material Stainless steel Description Analytical Location : AMERICA North (USA-Canada-Mexico)

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Exterior Dimensions Width 9.500 in (24.1 cm) Depth 9.500 in (24.1 cm) Height 18.000 in (45.7 Location : AMERICA North (USA-Canada-Mexico)

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Four Cassette Platforms 3 Axis Wafer Handling Robot Wafer Prealigner Station OCR Reader PC Controlled Location : AMERICA North (USA-Canada-Mexico)

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Wafer size: 8" Condition: as is - Load/Unload: Dual SMIF Arm with Wafer Transfer System (LRL process flow) - M Year(s) : 2001 Location : EUROPE (Western and Northern)

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Configuration: Configured as shown in pictures. Details coming soon ! Tester interface is not included. Teste Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

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Excellent operational condition Serial No: F12007JX Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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Excellent operational condition Serial No: F02088KR Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Configuration: KLA-Tencor 8100XP CD-SEM is an advanced metrology instrument with capability to provide super Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Performance Specification: • Feature Size: < 30 nm • Resolution: < 4 nm • Electron Source: Schottky, Therm Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Performance Specification: • Feature Size: < 30 nm • Resolution: < 4 nm • Electron Source: Schottky, Therm Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size: 150mm Location : AMERICA North (USA-Canada-Mexico)

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4400 series sputtering tool Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size: 150mm Location : AMERICA North (USA-Canada-Mexico)

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MA 150C Mask aligner TSA Top Side Only Wafer Size: 150mm Location : AMERICA North (USA-Canada-Mexico)

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#4 Plasmatherm VLR RIE LM/TM Year(s) : 1996 Location : AMERICA North (USA-Canada-Mexico)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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