2 KLA-Tencor 8100XPR CD-SEM
AMERICA North (USA-Canada-Mexico)
Performance Specification:
• Feature Size: < 30 nm
• Resolution: < 4 nm
• Electron Source: Schottky, Thermal Field Emitter
• Magnification: 2.34 kX - 400 kX
• Stage: X-Y leadscrew stage, Position Accuracy < 10 micron
• Accelerating Voltage: 0.4kV - 1.5kV
• Throughput: upto 50 wafers/hr
Configured as follows:
• 1 or 2 Reticle loading stations, 1 or 2 wafer cassette loading stations
• Reticle size: 5" or 6" square
• Wafer size: 3” – 8” (Si, GaAs, Sapphire, SiC, etc)
• Windows XP or MAC OS, user friendly interface
• 1 or 2 wafer loading stations (each can run multiple sizes)
• Chamber pump: Edwards or Varian dry scroll pump
• Load lock pump: Edwards or Varian dry scroll pump
• Dedicated UPS system for emergency power back up
• Power: 120V-220VAC, 1PH, 50/60HZ