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Used Wafer Equipment

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1

Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 100 mm Mask Plate Size 5'' x 5'' Alignment Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Upright Microscope Configuration Brightfield, Darkfield & DIC Illumination Type Reflected L Location : AMERICA North (USA-Canada-Mexico)

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Description Wafer Backlapping Film Applicator -- 6" Other Information Set up for 6" wafers Power Requiremen Location : AMERICA North (USA-Canada-Mexico)

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Substrate Size Up to 380MM Controller Model PCS 102 Resistivity Monitor YES Timer Duration 0-3 hours SRD C Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 75 mm Anti Static Probes YES Heated Nitrogen YES Rotors Included YES Controll Location : AMERICA North (USA-Canada-Mexico)

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Diameter 6.0000 in (152.40 mm) Plating Material Nickel Number of Micropositioners 0 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Set Size 150 mm Microscope Type Stereo Zoom X-Y Optics Motion YES Vacuum Chuck Dia Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Stereo Zoom Vacuum Chuck Diameter 6.0000 in (152.40 mm) Plating Material Stainless Location : AMERICA North (USA-Canada-Mexico)

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Binocular Angle 45° Eyepieces Model 31-15-71 Magnification 10 X Field Number 20 mm Trinocular/Phot Location : AMERICA North (USA-Canada-Mexico)

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Vacuum Chuck Diameter 5.9055 in (150.00 mm) Plating Material Stainless steel Description Analytical Location : AMERICA North (USA-Canada-Mexico)

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Exterior Dimensions Width 9.500 in (24.1 cm) Depth 9.500 in (24.1 cm) Height 18.000 in (45.7 Location : AMERICA North (USA-Canada-Mexico)

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Model LITHIUS I+ 300mm Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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Manufacturer Nexx Systems ELECTROPLATING TOOL with ANCOSYS AUTOMATED ANALYSIS AND DOSING Unit Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)

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Manufacturer SEMIgear Model Geneva RFL02 SemiGEAR Reflow Tool Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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1

300mm TEL Furnace Tool ID: BP02 Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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Four Cassette Platforms 3 Axis Wafer Handling Robot Wafer Prealigner Station OCR Reader PC Controlled Location : AMERICA North (USA-Canada-Mexico)

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Wafer size: 8" Condition: as is - Load/Unload: Dual SMIF Arm with Wafer Transfer System (LRL process flow) - M Year(s) : 2001 Location : EUROPE (Western and Northern)

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Configuration: Configured as shown in pictures. Details coming soon ! Tester interface is not included. Teste Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

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Excellent operational condition Serial No: F12007JX Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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Excellent operational condition Serial No: F02088KR Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Configuration: KLA-Tencor 8100XP CD-SEM is an advanced metrology instrument with capability to provide super Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Performance Specification: • Feature Size: < 30 nm • Resolution: < 4 nm • Electron Source: Schottky, Therm Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Performance Specification: • Feature Size: < 30 nm • Resolution: < 4 nm • Electron Source: Schottky, Therm Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size: 150mm Location : AMERICA North (USA-Canada-Mexico)

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4400 series sputtering tool Location : AMERICA North (USA-Canada-Mexico)

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You can find used Wafer Equipment on Wotol

The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics

The main model  MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150,  6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880

HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers. 
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices

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