Used Semiconductor Equipment

Accessories 3 monitors Condition Good Year of Manufacture 2011 Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Cassette Platforms 24 Robot Ma Year(s) : 1999 Location : EUROPE (Western and Northern)

Price : On request

Vintage : MAR 2013 Details 200-230V 3 Phase Specifications ( See Details above for installed options ) Nords Year(s) : 2013 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Top Down Viewing Camera 120VAC 1500W Max Specifications ( See Details above for installed options ) YESTech’s Location : AMERICA North (USA-Canada-Mexico)

Price : On request

INLINE AOI SYSTEM MODEL VT S500-02 Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Shadow Proof 3D Sensor 1D/2D Internal Reader Sigmalink Offline Review Software Vision 3D Program Inspection So Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Laser source Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Contact Profilometer Version: 150 mm Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

System configured for AsP use Version: 100 mm • E475 Stainless Steel High Efficiency Growth Chamber. Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Operational Status: Installed / Running Wafer Sizes: 4"/100mm Location : AMERICA North (USA-Canada-Mexico)

Price : On request

ESEC Die Bonder Accessories Monitors Condition Good Year of Manufacture 2001 Year(s) : 2001 Location : EUROPE (Western and Northern)

Price : On request

Plasma Etch Wafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Other Information proc Year(s) : 1995 Location : EUROPE (Western and Northern)

Price : On request

Model: M360CHD Indexer assy config Horizontal CPU: G Location : EUROPE (Western and Northern)

Price : On request

TSK UF200H Wafer Prober Tool condition: Working Wafer Size 5-8&quot Location : EUROPE (Western and Northern)

Price : On request

Wafer Inspection Microscope Model MIS200 Location : EUROPE (Western and Northern)

Price : On request

VERTICAL FEED, HEATED WORK HOLDERS AND HEATED TRANSDUCER OPTIONS Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Measurement: Film thickness/Fluorescent X-ray Model XDVN-W Location : ASIA (North East)

Price : On request

The aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 60 lbs and the size is 12″ W Location : AMERICA North (USA-Canada-Mexico)

Price : On request

manual wedge bonder Location : AMERICA North (USA-Canada-Mexico)

Price : On request

KLA SP3 Main Components - • Integrated Console • Bare Wafer Inspection Station • Equipment Front End Module (E Location : EUROPE (Western and Northern)

Price : On request

MP200 double path tool non copper tool; double path tool delay stage; 6 inch chuck Cooling Water Required Min Year(s) : 2002 Location : EUROPE (Western and Northern)

Price : On request

Leica INS3300 is the most advanced solution in the production control of 200 mm and 300 mm wafers. This compa Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Karl Suss MA8/BA6 Mask Aligner consisting of: - Model: MA8/BA6 - Configured for Topside Alignment (TSA) Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Nikon Eclipse L200N Microscope consisting of: - Model: Eclipse L200N - L200N Stand with built in Transformer ( Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

GROSS LEAK PRESSURE SYSTEM Location : AMERICA North (USA-Canada-Mexico)

Price : On request