KLA-Tencor Surfscan SP3 Defect and Surface Quality Inspection Systems – UDL/UDK

KLA SP3 Main Components -
• Integrated Console
• Bare Wafer Inspection Station
• Equipment Front End Module (EFEM)
• 3 Port Wafer Loading Unit

Description of Inspection System -
• Un-patterned wafer inspection platform to incorporate deep-ultraviolet (DUV)
illumination. Deep Ultraviolet (DUV) source
• DUV-specific apertures to enable defect capture on un-patterned thin films
• High speed stage and advanced imaging computer for enhanced productivity
• Full-wafer high-resolution haze maps

Defect Detection and Classification Capabilities
• Designed to capture a broad range of challenging defects for
32nm/22nm process nodes
• High-productivity rapid automated defect classification
• Coordinate accuracy to enable rapid defect re-detection and review
• Integrated, high resolution (~100 mega-pixel), full-wafer SURFmonitor™ haze maps,
providing automated capture of ultra-fine slip lines and scratches or maps of
surface roughness, grain size and other process parameters
• Surfscan SP3 system feature dramatic advances in sensitivity and
throughput over their industry-benchmark predecessor, the Surfscan SP2XP
• Inspection Module for the back side of wafers for
defects that might deform the wafer shape.