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Used Semiconductor Equipment

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1

manual wedge bonder with Z lever and U.S. generator. AUTO TUNE ULTRASONIC GENERATOR INCLUDES CALIBRATED STEREO Location : AMERICA North (USA-Canada-Mexico)

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Condition Good Exterior Dimensions Width 35.433 in (90.0 cm) Depth 47.244 in (120.0 cm) Height 66.92 Year(s) : 2000 Location : EUROPE (Western and Northern)

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ESEC Die Bonder Accessories - Monitors Condition Good Year of Manufacture 2004 Year(s) : 2004 Location : EUROPE (Western and Northern)

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MidCurrent Implanter Condition Good Power Requirements 208 V CE Marked YES Year(s) : 2002 Location : EUROPE (Western and Northern)

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Thin Film Stress Measurement System, 150 mm and 200 mm wafer Location : AMERICA North (USA-Canada-Mexico)

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909 ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder. It is specifically useful fo Location : AMERICA North (USA-Canada-Mexico)

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FRONT SIDE ALIGNMENT HIGH RESOLUTION ALIGNMENT FOR UP TO 4″ WAFERS SUSS POWER SUPPLY Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)

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12.25×12.25 SQUARE BEAM (EXPOSURE HEAD IS MOTORIZED) 500 WATT LAMP, SPLIT FIELD VIDEO OPTICS WITH FLAT SCREEN Location : AMERICA North (USA-Canada-Mexico)

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MidCurrent Implanter Condition Good Year of Manufacture 2002 Power Requirements 208 V CE Marked YES Year(s) : 2002 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 150 mm Maximum 300 mm Set Size 300 mm Number of Robots 1 Position 1 Tank M Year(s) : 2016 Location : EUROPE (Western and Northern)

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TWS-M3111 Software Version TWS-M3111 Electric Schematic Number 81152323 Condition Very Good Power Requirement Year(s) : 2011 Location : EUROPE (Western and Northern)

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OPTORUN OWLS-D OPTICAL SPUTTER COATER SYSTEM consisting of: - Model: OWLS-1800DV2H - Vacuum Chamber: W2540mm× Location : AMERICA North (USA-Canada-Mexico)

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Laser Marking System Marking Field (mm): 350x350 Machine configuration: Transport height: 920 mm ± 50 mm Int Year(s) : 2016 Location : AMERICA North (USA-Canada-Mexico)

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Si wafers, 200/300mm wafers, Bright and Dark Field, 0.2 um pixel size, 10.5 Soft version, RBB classification Location : AMERICA North (USA-Canada-Mexico)

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Si, Gan & Gas, Saphire 150/200mm, Bright and Dark Field, 0.2 um pixel size, 10.5 Soft version, RBB classificat Location : AMERICA North (USA-Canada-Mexico)

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DOM: Dec 01, 2006 Application: Engraving on printed circuit boards. - 30 watt laser CO2 Features: SMEMA-spec Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Dual 300mm FIMS – DBS, SE, Stress, 200/300 mm chuck, Win NT, Summit 3.3, upgradable Location : AMERICA North (USA-Canada-Mexico)

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RFL02 SemiGEAR Reflow Tool , 300mm Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)

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Thin Film measurement tool Location : AMERICA North (USA-Canada-Mexico)

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Deep UV Wafer Stepper, 300mm, Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Metrology Location : AMERICA North (USA-Canada-Mexico)

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Manual Photoresist Coaters 200mm, Location : AMERICA North (USA-Canada-Mexico)

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Multi Wafer size wafer sorter Location : AMERICA North (USA-Canada-Mexico)

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Scanning Electron Microscopes 300mm, s/n: UV1158 Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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Brightfield Inspection 300mm, s/n: 1340334 Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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