Used Semiconductor Equipment

Condition Good Exterior Dimensions Width 49.213 in (125.0 cm) Depth 86.614 in (220.0 cm) Height 90.9 Year(s) : 2014 Location : EUROPE (Western and Northern)

Price : On request

Plasma Etch System: It uses a plasma-based process to selectively remove materials from the wafer surface, suc Location : AMERICA North (USA-Canada-Mexico)

Price : On request

This West-Bond West-Bond 7372B Convertible Die Bonder can be converted between a 7200B Epoxy Die Bonder, and Location : EUROPE (Western and Northern)

Price : On request

PECVD 80+ SiO2 Dep Non-functional tool but can be repaired (requires Silane MFC) Designed for 4” wafers but ca Location : EUROPE (Western and Northern)

Price : On request

This West-bond 7400A Manual Ultrasonic/ Thermosonic 45° Feed Wedge-Wedge Wire Bonder looks to be in good cosm Location : EUROPE (Western and Northern)

Price : On request

5200, 200mm, s/n: 2070 Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Raider ECD310 Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Brand: Manncorp Manncorp Sherlock-300B Batch AOI Machine Minimum PCB Size 2" x 3.15" (50 mm to 80 mm) Maximu Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier NOVA Model NOVA T600 Vint Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size 300 mm Fab Section Diffusion General Product Information Vendor Supplier APPLIED MATERIALS Model C Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model FRONTIER - Etc Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Semi Auto wafer level Debonder Suitable for 200mm and 300mm Wafers. Year(s) : 2013 Location : EUROPE (Western and Northern)

Price : On request

Bonder Model 7200 Year(s) : 2008 Location : EUROPE (Western and Northern)

Price : On request

Three MaxumPlus Bonders upgraded by KNS from Maxum. Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Microscope autoloader only (Not including the microscope) Version: 100 MM AND 150 mm -Deinstalled to warehouse Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Large Area PECVD system, used for SiO and SiN process depositions Version: 150 mm Vintage: 01.06.2015 Plasmat Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Oxide Etcher, fitted with 4 process chambers Version: 300 mm Vintage: 01.06.2012 -Tool Vintage: Jan 2012 -Tool Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Measurement: Thickness Year(s) : 1999 Location : ASIA (North East)

Price : On request

Stepper Maker Nikon Model NSR-1755G7A Year(s) : 1990 Location : ASIA (North East)

Price : On request

Stepper Maker Nikon Model NSR-1755i7A Year(s) : 2002 Location : ASIA (North East)

Price : On request

Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier HSEB (now Unity SC) Model Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size 200 mm Fab Section Etch General Product Information Vendor Supplier LAM Model 9600 BRME Vintage 19 Year(s) : 1998 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size 300 mm Fab Section R&D General Product Information Vendor Supplier Novellus Model Novellus Vector Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Condition Good Exterior Dimensions Width 50.000 in (127.0 cm) Depth 86.614 in (220.0 cm) Height 74.0 Year(s) : 2003 Location : EUROPE (Western and Northern)

Price : On request

Condition Good Year of Manufacture 2000 Exterior Dimensions Width 531.496 in (1,350.0 cm) Depth 456.69 Year(s) : 2000 Location : EUROPE (Western and Northern)

Price : On request