Koh Young KY8030-3 3D Solder Paste Inspection

Brand: Koh Young Technology
Power: 220V a.c
Type: 3D SPI

FEATURES:
- Inspection speed at 0.24sec/FOV
- 3D Shadow Free Moiré Technology & Dual Projection
- Multi FrequencyFree Moiré Technology + Z Tracking
- Renewal GUI software
- 4M Pixel High Spped Camera
- Metrology Capability: Volume, Area, Height, Offset, Bridging,
Shape Deformity, Coplanarity
- FOV (Field of View) Size: 40 x 40 mm (1.60 x 1.60 inch)
- Max. Paste Size: 0.3 x 0.30 inch
- Conveyor Width Adjustment: Automatic
- Conveyor Fix Type: Front/Rear Fixed