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Used Semiconductor and PCB Manufacturing

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APT-4800 Wafer Size 8 Year(s) : 2000 Location : ASIA (North East)

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Eagle 12 Wafer Size 12 Year(s) : 2010 Location : ASIA (North East)

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Eagle 10 Wafer Size 8 Location : ASIA (North East)

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Wafer Size 12 Year(s) : 2003 Location : ASIA (North East)

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AMC7821 Wafer Size 6 Year(s) : 1983 Location : ASIA (North East)

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AMC7821 Wafer Size 6 Year(s) : 2001 Location : ASIA (North East)

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AMC7811 Wafer Size 6 Year(s) : 1990 Location : ASIA (North East)

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AMC7800RPX Wafer Size 6 Year(s) : 1982 Location : ASIA (North East)

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Endura CL Wafer Size 12 Year(s) : 2000 Location : ASIA (North East)

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COMPASS 300 Year(s) : 2000 Location : ASIA (North East)

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Wafer Size 5 Year(s) : 1996 Location : ASIA (North East)

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S-9380 Wafer Size 12 Year(s) : 2004 Location : ASIA (North East)

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Wafer Size 12 Year(s) : 2010 Location : ASIA (North East)

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LITHIUS i+ Wafer Size 8 Year(s) : 2006 Location : ASIA (North East)

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YES-5E Wafer Size 6 Location : ASIA (North East)

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N-2 Cylinder cabinet (purge N2) Year(s) : 1992 Location : ASIA (North East)

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CHIP UNZIP Wafer Size 6 Year(s) : 1996 Location : ASIA (North East)

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OAPM-400 Wafer Size 5 Year(s) : 1993 Location : ASIA (North East)

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S-5000 Wafer Size 6,8 Location : ASIA (North East)

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DFG-83H/6 Description Back side grinder Year(s) : 1994 Location : ASIA (North East)

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K91006 Description Wet cleaning (Pure Water) Year(s) : 1991 Location : ASIA (North East)

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BMC-600 Description Dry etching system (Pt) Location : ASIA (North East)

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VDS-5500 Description P-CVD Year(s) : 1988 Location : ASIA (North East)

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XF5-Ⅱ Description Wet etching system (SiO2) Year(s) : 1984 Location : ASIA (North East)

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Wet etching system (SiO2) Year(s) : 1995 Location : ASIA (North East)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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