Used Wafer Equipment
430 resultsWafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Condition Excellent Year of Manufac Year(s) : 1900 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size 300 mm Fab Section Material Handling General Product Information Vendor Supplier Rorze Model A4-BL Year(s) : 2006 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Clean General Product Information Software Version 258000 CIM E84, SECS/GEM, GE Year(s) : 2012 Location : United States (USA)
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More detailsWet Process Equipment Year(s) : 2006 Location : United States (USA)
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More detailsDeep UV Wafer Stepper 300mm, s/n: 8732034 Year(s) : 2006 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Test General Product Information Vendor Supplier TEL Model P8XL Prober Vintage Year(s) : 2000 Location : United States (USA)
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More detailsWafer Size 300 mm Fab Section Test General Product Information Vendor Supplier TEL Model Precio XL Vintage 20 Year(s) : 2021 Location : United States (USA)
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More detailsAsset Description Wafer prober Software Version 4.9.3_160381 Process Wafer prober Hardware Confguration (Fab) Year(s) : 2011 Location : United States (USA)
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More detailsSingle Wafer Resist Strippers Year(s) : 1999 Location : United States (USA)
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More detailsIon Implanters 200mm Year(s) : 2003 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier CFM Model FullFlow 1/99 8100 Year(s) : 1999 Location : United States (USA)
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More detailsWafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier CFM Model FullFlow 1/99 8100 Year(s) : 1999 Location : United States (USA)
Price : On request
More details200mm, s/n: 1080 Location : United States (USA)
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More detailsGeneral Product Information Vendor Supplier MATTSON TECHNOLOGY Model ASPEN 2 Vintage 1999 Asset Description MA Year(s) : 1999 Location : United States (USA)
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More detailsGeneral Product Information Vendor Supplier DISCO Model DGP8761/Type DP Vintage 2012 Asset Description BSG900- Year(s) : 2012 Location : United States (USA)
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More detailsGeneral Product Information Vendor Supplier LINTECH Model RAD-3510F/12 Vintage 2012 Asset Description BSL900-T Year(s) : 2012 Location : United States (USA)
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More detailsTransaction Information Tool ID OP 922 Tool Status Connected Wafer Size 300 mm Fab Section Defect Detection Year(s) : 2007 Location : United States (USA)
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More detailsVendor Supplier DISCO Model DGP8761/Type DP Vintage 2018 Asset Description BSG903U1-TR DISCO DFM2800 Fully au Location : United States (USA)
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More details200mm, s/n: 9152 AIT II w/ ADC. Defect Inspection Year(s) : 2000 Location : United States (USA)
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More detailsAIT II, 200mm, s/n: 9262 Year(s) : 2009 Location : United States (USA)
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More detailsWET SCRUBBER/BRUSH CLEANER Year(s) : 2012 Location : United States (USA)
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More detailsSPECTRACD-XT, 300mm, s/n: 6511267 Year(s) : 2009 Location : United States (USA)
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More detailsTool ID ASMS707 Tool Status Disconnected Wafer Size 300 mm Fab Section Material Handling Tool Available Date 2 Year(s) : 2005 Location : United States (USA)
Price : On request
More detailsTool Status Disconnected Wafer Size 300 mm Fab Section Material Handling Year(s) : 2007 Location : United States (USA)
Price : On request
More detailsBKD4 Poongsan GENI HP Anneal High Pressure 300mm Year(s) : 2011 Location : United States (USA)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices