Used Wafer Equipment
437 resultsManufacturer Nexx Systems ELECTROPLATING TOOL with ANCOSYS AUTOMATED ANALYSIS AND DOSING Unit Year(s) : 2009 Location : United States (USA)
Price : On request
More detailsManufacturer SEMIgear Model Geneva RFL02 SemiGEAR Reflow Tool Year(s) : 2004 Location : United States (USA)
Price : On request
More details300mm TEL Furnace Tool ID: BP02 Year(s) : 2008 Location : United States (USA)
Price : On request
More detailsTAMARACK M423 EXCIMER, sn: 423-91101 Year(s) : 2012 Location : United States (USA)
Price : On request
More detailsProber Model P12XL 300mm Year(s) : 2003 Location : United States (USA)
Price : On request
More detailsNSR-S208D, 300mm, s/n: 8732048 Year(s) : 2011 Location : United States (USA)
Price : On request
More details300mm Prober single foup VIP3A Tool ID: 33B4WA Year(s) : 2004 Location : United States (USA)
Price : On request
More detailsMounter Wafer Size Range Set Size 200 mm Condition Good Year(s) : 1996 Location : EUROPE (Western and Northern)
Price : On request
More detailsDefolieranlage Condition Very Good Power Requirements Other V 50 Hz 3 Phase Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsOxid Prozess Wafer edge cleaner, EVCII PC, SW 8.601 Conditioner new type Flowcontroller für Slurry #2, additio Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsFUSION 150/3D Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Condition Good Power Requir Year(s) : 1996 Location : EUROPE (Western and Northern)
Price : On request
More detailsSEMITOOL SPRAY SOLVENT TOOL (SST) consisting of: - Model: 421 - Automated Spray Solvent Tool (SST) - Proce Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDe-foiling system Wafer Size Range Set Size 150 mm Condition Good Power Requirements 230 V 50.0 A Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsModel SFS 6200 Wafer Size 8" Vintage 1994-2 Tool's Condition Excellent Description *.Configuration: - Wafe Year(s) : 1994 Location : ASIA (North East)
Price : On request
More detailsWafer Size Range Minimum 150 mm Maximum 150 mm Set Size 150 mm Condition Good Power Requirements Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Exterior Dimensions Width 90.551 in (230.0 cm) Depth 133.858 in (340.0 cm) Height 102 Year(s) : 1997 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Condition Excellent Power Requirements Location : EUROPE (Western and Northern)
Price : On request
More detailsWSS Glass Demount Wafer Size Range Set Size 200 mm Condition Very Good Year(s) : 2014 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Power Requirements 220 V 24.0 A 15.0 A(2) 50 Hz 3 Phase Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsWAFER SPECIFICATION Wafer Size 150mm SYSTEM CONFIGURATION CHAMBER A CHAMBER B Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsCondition Good Power Requirements 200-240 V 50/60 Hz 3 Phase Weight 1,213 lb (550 kg) Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsTool still maintained within Basic-Maintenance contract by KLA! Condition Excellent Power Requirements 208 V Year(s) : 2017 Location : EUROPE (Western and Northern)
Price : On request
More detailsE220 EHPi, 8" DI Cart: EHPI, B-Pure filter Chamber A (DPN): Aluminum material Gas box: 4-Sicks HP SDS2 Missing Year(s) : 2001 Location : EUROPE (Western and Northern)
Price : On request
More detailsComplete and working condition Still installed Year(s) : 1992 Location : EUROPE (Western and Northern)
Price : On request
More detailsCurrently tool is still warm down Condition Good Year of Manufacture 2006 Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices