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Used Semiconductor and PCB Manufacturing

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Wafer Size Range Maximum 125 mm Controller Type Microprocessor Controller Type Controller Model C225 Ro Location : AMERICA North (USA-Canada-Mexico)

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Width 36.000 in (91.4 cm) Depth 10.236 in (26.0 cm) Height 48.000 in (121.9 cm) Year(s) : 1997 Location : AMERICA North (USA-Canada-Mexico)

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Dry Pump YES Pumping Speed 391.0 CFM (11,048.7 l/m) Ultimate Pressure 3.70E13(En) torr (4.93E13 mbar) I Location : AMERICA North (USA-Canada-Mexico)

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Diameter 6.0000 in (152.40 mm) Plating Material Nickel Number of Micropositioners 0 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 200 mm Number of Tracks 0 Number of Photoresist Coat Stations 1 Number of Photo Location : AMERICA North (USA-Canada-Mexico)

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Description Sawed Wafer Cleaner Accessories CO2 Reionizer (Eliminates the corona in the jet stream) Wash Spi Year(s) : 2002 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Set Size 150 mm Microscope Type Stereo Zoom X-Y Optics Motion YES Vacuum Chuck Dia Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Stereo Zoom Vacuum Chuck Diameter 6.0000 in (152.40 mm) Plating Material Stainless Location : AMERICA North (USA-Canada-Mexico)

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Maximum Substrate Diameter 4.000 in (10.2 cm) Other Information Automatic film mounter Film length 200m Fr Year(s) : 1994 Location : AMERICA North (USA-Canada-Mexico)

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Specifications: Workpiece material: Glass Max substrate: 300mm X Axis Specifications: Stroke: 300mm S Location : AMERICA North (USA-Canada-Mexico)

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General Specifications: Table diameter: 300mm Max. workpiece size: 400mm dia x 200mm H Table revolution speed: Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

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Description Residual Gas Analyzer Mass Range 200 AMU Other Information System components Quadrex 200: Part Location : AMERICA North (USA-Canada-Mexico)

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Maximum Output Voltage 300.00 Volts Maximum Output Current 16.00 Amps Maximum Output Power 4.80 kW Regulati Location : AMERICA North (USA-Canada-Mexico)

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Features Black & White CCTV System Package depth sensor for consistent & precise bond line thickness Location : AMERICA North (USA-Canada-Mexico)

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Illumination Source Type HeNe Laser Software Revision Level 1.2 Other Information Gaertner GEMP Version 1.2 Location : AMERICA North (USA-Canada-Mexico)

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Manual Load Automatic Substrate Cleaner Process Chamber Clean room class 100 Substrate size: 6.5" X 6 Year(s) : 1993 Location : AMERICA North (USA-Canada-Mexico)

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Minimum Temperature -30 ºC (-22 ºF, 243.00 ºK) Maximum Temperature 150 ºC (302 ºF, 423 ºK) Capacity/Liqu Year(s) : 1994 Location : AMERICA North (USA-Canada-Mexico)

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Model TCR 40S70 Maximum Output Voltage 40.00 Volts Maximum Output Current 70.00 Amps Maximum Output Power Location : AMERICA North (USA-Canada-Mexico)

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Maximum Temperature 260 ºC (500 ºF, 533 ºK) Clean Room Class Class 100 Temperature Control Control Sta Location : AMERICA North (USA-Canada-Mexico)

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Description Gen 5 PEVCD Chamber - New Accessories Substrate Size: 1200 mm x 1300 mm Location : AMERICA North (USA-Canada-Mexico)

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Interface IEEE 488-GPIB Other Information Two output channels Options: 94/95/96/98/99 Power Requirements 1 Location : AMERICA North (USA-Canada-Mexico)

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Maximum Output Voltage 50.00 Volts Maximum Output Current 50.00 Amps Maximum Output Power 2.50 kW Regulatio Location : AMERICA North (USA-Canada-Mexico)

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Maximum Output Voltage 300.00 Volts Maximum Output Current 35.00 Amps Maximum Output Power 10.50 kW Regulat Location : AMERICA North (USA-Canada-Mexico)

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Maximum Temperature 30 ºC (86 ºF, 303 ºK) Minimum Temperature 75 ºC (167 ºF, 348.00 ºK) Temperature Cont Location : AMERICA North (USA-Canada-Mexico)

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Gen 6 PEVCD Chamber - Accessories Substrate Size: 1500 mm x 1850 mm MKS ASTeX Remote Plasma Source, Model: Location : AMERICA North (USA-Canada-Mexico)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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