Used Wafer Equipment
404 resultsWafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier CFM Model FullFlow 1/99 8100 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDetaping 6" thinwafer Wafer Size Range Minimum 200 mm Maximum 200 mm Set Size 200 mm Cassette to Ca Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size 200 mm Fab Section Clean General Product Information Vendor Supplier CFM Model FullFlow 1/99 8100 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Size Range Minimum 200 mm Maximum 300 mm Set Size 300 mm Cassette to Cassette YES Wafer Hand Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details200mm, s/n: 1080 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailswafer Location : AMERICA North (USA-Canada-Mexico)
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More detailsGeneral Product Information Vendor Supplier MATTSON TECHNOLOGY Model ASPEN 2 Vintage 1999 Asset Description MA Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGeneral Product Information Vendor Supplier DISCO Model DGP8761/Type DP Vintage 2012 Asset Description BSG900- Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGeneral Product Information Vendor Supplier LINTECH Model RAD-3510F/12 Vintage 2012 Asset Description BSL900-T Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsTransaction Information Tool ID OP 922 Tool Status Connected Wafer Size 300 mm Fab Section Defect Detection Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition: good Manufacturer Powatec Model Wafer Mounter Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsVendor Supplier DISCO Model DGP8761/Type DP Vintage 2018 Asset Description BSG903U1-TR DISCO DFM2800 Fully au Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCondition: very good Yushin Demounter 1 3Teile Glas Demount Tool for 6 and 8 inch Wafer. Glas Output Statio Year(s) : 2006 Location : EUROPE (Western and Northern)
Price : On request
More details200mm, s/n: 9152 AIT II w/ ADC. Defect Inspection Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAIT II, 200mm, s/n: 9262 Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsNanospec Wafer Metrology film thickness measurement tool Version: 200 mm Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsManufacturer: POWATEC Vintage: 01.06.2000 The equipment has been professionally de-installed, and is currentl Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsKLA-TENCOR FLX-2320 FILM STRESS MEASUREMENT SYSTEM consisting of: - Model: FLX-2320I - Manual Wafer Load - Thi Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer autoloader (Not including microscope) Version: 100MM TO 150 MM Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer Sorter with 4 wafer loading ports Version: 300 mm Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsDual arm Atmospheric wafer handling robot Version: 200 mm Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsChip mounter Maker Panasonic Model CM 202-D Year(s) : 1999 Location : ASIA (North East)
Price : On request
More detailsChip mounter Maker Panasonic Model CM 20F-M Year(s) : 1998 Location : ASIA (North East)
Price : On request
More detailsChip mounter Maker Panasonic Model CM 402M Year(s) : 2004 Location : ASIA (North East)
Price : On request
More detailsManufacturer: RECTIF Wafer Sorter with 2 wafer loading ports Version: 300 mm Vintage: 01.07.2005 Deinstalled t Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Wafer Equipment on Wotol
The main manufacturers of Wafer Equipment are KLA-Tencor, Karl Suss, Canon, Electroglas, Suss, Nikon, Semitool, TEL, Tokyo Semitsu Kogaku (TSK), Branson / IPC, MGI, Ultron, EVG, Allwin21, Abm, Accretech, ADE, AG Associates, AIO, Alessi, Applied Materials, ASM, ASML, Asyst Technologies, ATMI, Axcelis, Brooks Automation, Buehler, Cambridge, Cascade, Cascade Microtech, CDE (Creative Design Engineering), CEE, CHA, Control Micro Systems (CMS), Cymer, Dainippon Screen,Dektak, Denton, Disco, DNK, DNS, Dynapert, Dynatex, Electroglass, EV Group, Evergreen, Faith, Fluoroware, Fortrend Engineering, Gasonics, GCA, GSI Lumonics, Hitachi, HTG, IMT, InspecTech, Ionic Systems, Jeol, K & S, Kensington, KLA, Kokusai, LAM, Lam Research, Leica, Lintec, Loomis, Lumonics, Mactronix, Matsushita, Mech-El, Micro Automation, MRC, MTI, Nanometrics, Nitto, OAI, Olympus, Oriel, Oxford, Perkin Elmer, PRI, Prometrix, Recif SA, Rucker & Kolls, Suss MicroTec, SVG, Takatori, Tegal, Tencor, Tropel, Ultracision, Ultratech, Ulvac, Veeco, Verteq, Wentworth, Xynetics
The main model MPASeries, CDS-650CT, PLA-501F, MA-4100, NSR-1505G4, 1000, Titan II, MA150, 6033, 2029,2020,2025, 6200Series, SM200E, Step 200,UM810, UH-130, UF3000 EX, SFX100, M777, FPA-5500iZa, SR8220-019, Desktop 1, 270 SRD, ST-260, 1600-55, 8100XP, 8100Series, 1H-DX, KP-4200, MA-4201Series, MA-1006, L200,UH130M,DFM-M150, CEE 100, SP323, MJB3Series, JWSSeries, MA6Series, SWC4000, EX-5700, 2001X, MDA-60FA, 680A, 8300, ARM200CF, S-5200, S-4700, AS5000, Axiotron II, INS330, Axiospect 301, SF 600, WaferMark II,3308, MASeries, 20T2/150VPO, 860, 1600-55A, UH 102, 4000, Eureka 450, ETI0392A-6-U, 425130, ETII-6910B-X-V, EET1-0395D-X-U, ETII-6910B-X-V, F-6225, 827, 907, 211,UVSeries, AIT8010, eCD2, 8100XPR, CD-SEMSeries, 8250, PC 4400, 300405, SFS 6420, 6D, MM-Cascade 6100, MJB-55, 179884/ P-2 OPEN FRAME, 8300X, 4500, ATRM-2100, SWC11, MAS-8000,ATM-1100E, 3A, 90, RTP-600xp, UKA-650, SPP8, MP 2300, BH-BHM, 2066,AL100-L8, IDLW8R, REL-4500, IDLW8R, MAS-8000, Fix Load25, UKA-825, SCW111, ATRM-2100D, 4055/2, Optistation 3, REL-4500, ResMap 178, 8097, 1600-55m, LSD 100, DSL 10, H100, RHM-06, 908, UH-130, 600W, 100FX, RS 35, P16+, 8620, MA8/BA8 Gen3, lle-855SS, 85DD, SFS7700, 2300 Versys, ZX-1000, Mark7, S-7800HSA, 5610,ES3, M-GAUGE 200, AITI,SFS7200, THERMA-WAVE OP 2600, MA150, 2115, 9400, NGP80, 620, XRF3640, CTR-200, TREX 610, F-4225, EET10395-4-U, SYO-200SS, MS100, RS-75, 7400/18, 2001X 6, PLA-501FA, PS300 Parametric Serie 12, DX-III, SHS 1000VAC, V300-Si, 12", WM650, AlphaStep 300, SURFSCAN 7700, 903eSeries, F6000QS, SP1 TB1, Nanolab 600, NWL860-TMB-SP, F5, DSS200, RS35C, MX-50, DD-823V-8BL, MicroSense 6300, 2400, 4400,E5200, 8108, 600FA, 40, MRC 603, 7700, VersaPort 2200, R-3, SSEC M10, ST-270 SRD, L3510, HTC 8020, Lumonics III, 1800-6AR, HTC 4000, SSW-60A-AR, 1034X, WST 306, ST-860, KIS 2000, L3510E, 9350, PSM 6, 80B, RS-35, DR-8500 II, 301, VLR RIE LM/TM, 20T2/150VPO, 1034 XA – 6, 4085XSeries, 682A, 500R 120-1007, E8025S, 100 RIE, M6000L, EV CS50, 150, RC8, ATM-105-1-S-CE-S293, MPC3000, DMI4000B, 5100, F5x, P-10, LP-200H, F200, CMS1030, CW1002-6200RW, 8860, APM90A, 3001X, APM5000, 880
HS Code 8486 10 10 for Apparatus for rapid heating of semiconductor wafers.
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devicesde8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices