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Used Semiconductor Equipment

3,405 results
1

Max. 12 inch, has NCS, has BBD Working condition Year(s) : 2005 Location : ASIA (North East)

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Semi Automatic Dicing Saw Location : ASIA (North East)

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Dicing/Cutting/Slotting various wafers Location : ASIA (North East)

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Fully Automatic Dicing Saw Location : ASIA (North East)

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Cut speed 0.1 ~ 450 (mm/s) Y-axis Useable stroke 210 (mm) Indexing step 0.0002 (mm) Position accuracy (cumula Location : ASIA (North East)

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Position accuracy (cumulative pitch error) less than 0.005/160 (mm) Position accuracy (single pitch error) le Location : ASIA (North East)

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Dicing/Cutting/Slotting various wafers Location : ASIA (North East)

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Equip Name : ODSlicing Systems Workpiece Dimensions(mm) : 120x60x210 Max. travel X 250mm Y 160mm Z 105mm Location : ASIA (North East)

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Z-axis Maximum stroke (mm) 7.2 (for ø 2" blade Moving resolution (mm) 0.00025 Repeating accuracy (mm) 0.001 Ma Location : ASIA (North East)

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Workpiece handling size : ø152.4 mm(ø6") (max. diameter) 1.5 kW Synchro SpindleTM (air bearing spindle) X - a Location : ASIA (North East)

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Cutting water 0.2 4.0 (L/min) Cooling water more than 1.5 (L/min) Duct required suction 2.5 5 (m3/min) Machine Location : ASIA (North East)

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The Nanospec 210 is a wafer tester that has a film thickness measurement system. It has a 100 angstrom resol Location : AMERICA North (USA-Canada-Mexico)

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The Sloam M-100 wafer tester has an interferometer, which measures wafter thickness by optical fringes. This Location : AMERICA North (USA-Canada-Mexico)

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Measurement Display Range … 200 A to 655,000 A (20nm to 65,000nm) Vertical Resolution … 5A (.5nm) Scan Length Location : AMERICA North (USA-Canada-Mexico)

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Microscope Configuration Brightfield Illumination Type Reflected Light Binocular Angle 45° Eyepieces Mo Location : AMERICA North (USA-Canada-Mexico)

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Microscope Type Microzoom Multiple Objectives Models Bausch and Lomb 2.25 X 0.04 N.A. 8 X 0.15 N.A. 25 X 0.3 Location : AMERICA North (USA-Canada-Mexico)

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Exterior Dimensions Width 38.000 in (96.5 cm) Depth 25.750 in (65.4 cm) Height 72.000 in (182 Location : AMERICA North (USA-Canada-Mexico)

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VERTICAL FEED WEDGE BONDER INCLUDES STEREO ZOOM OPTICS good condition Location : EUROPE (Western and Northern)

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Microscope for machines (without stand) Objective: Nikon G-AL 0,29 x Oculars: 20 x Illumination: up to 29 x o Location : EUROPE (Western and Northern)

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This tool includes chem cabinets and Temperature and Humidity module. The controller is programed in DOS. Pump Location : EUROPE (Western and Northern)

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Odd Form Placer ONLY 930.00 Hours. IN LIKE NEW CONDITION Daily Maintenance performed while under operation App Year(s) : 2018 Location : AMERICA North (USA-Canada-Mexico)

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Full 3D Inspection (Actual 3D) Inspection Irrelevant to Color, Material, Surface Roughness Foreign Material & Year(s) : 2022 Location : AMERICA North (USA-Canada-Mexico)

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Typ: 10000186 UV 300/400 50 Hz 3” Chuck, 4” x 4” Mask Holder Objectiv Leitz 5x 0,09; 10x 0,20; 20x 0,40; 32 Year(s) : 2004 Location : EUROPE (Western and Northern)

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This West-Bond 7400B 45° Feed Manual Wedge Wire Bonder (s/n 12422) looks to be in good cosmetic condition, s Location : EUROPE (Western and Northern)

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This West-Bond 7700B Gold Ball Wire Bonder looks to be in good cosmetic condition, showing some signs of wear Location : EUROPE (Western and Northern)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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