2 Semix Tazmo TR 6133UD

Photoresist Coater and Developer tRACK, SOG type
Version: 100 mm to 150 mm
for Wafer Size: 4"- 6"

Coater systems,
4"-6" (3) Zone hotplate Single / double cassette
Fluoroware type with pitch of 3/16" for
(25) Wafers SOG Nozzles: 0.85mm,
1/16" tubing Nozzle capping mechanism
Nozzle cleaning with solvent
Splash back cup cleaning with solvent
Adjustable suck back valve
Polypropylene tank: 1 gallon PVC,
11" Teflon solvent tubing and suck back valve
(3) Vacuum chuck hot plates
Heater capacity: 3.8 Kw (total) at 250°C
Baking time: 0-999.9 secs with increments of 0.1 sec
Normal indicator setting: ±3°C SOG
Filter: .22 μm
Fluoropore fitter
Chemical cabinet: 5
Gallon capacity (2)
Nozzles back side rinses (edge bead removal)
Solvent filter: MILLIPORE CWFG00403 Fluorex / WGFG04HP6 Wafergard
Gas line filter: MILLIPORE GTL WGFG01D
Wafergard 0.22 μm filter
Wafer transport system: Indexing elevator
Vacuum chuck
Shuttle mechanism
Walking beam

Control unit:
Microprocessor: INTEL 8065 (main and (2) sub CPUs)
Speed: 100-9000 RPM (4") / 8000 RPM (6") ± .15% (50-1990 RPM)
and ±.1% (2000-6000 RPM)
Alarm for speed ±3% of RPM (speed higher than 300 RPM)
Acceleration:
Maximum rate 1 sec for 0 to 5000 RPM (programmable in increments of 1 sec)
Process: 20-Steps, 8 / 16 recipes
Temperature control: ±1°C
Uniformity with alarm setting of ±3°C
Spinning, dispensing time: 0-99 Sec programmable
Baking time: 0-999 Sec programmable
Process display: Back-lit LCD.