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Used Semiconductor and PCB Manufacturing

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1

Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier NOVA Model NOVA T600 Vint Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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Wafer Size 300 mm Fab Section Diffusion General Product Information Vendor Supplier APPLIED MATERIALS Model C Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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Wafer Size 300 mm Fab Section Thin Film General Product Information Vendor Supplier AMAT Model FRONTIER - Etc Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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[Specifications] Model year: 2016 Observation window: Yes Temperature range: -40 to +150°C Shelf: 1 Humidity Year(s) : 2016 Location : ASIA (North East)

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[Specifications] Model year: 2020 Observation window: None Temperature range: -20 to +150°C Shelf: 1 Humidit Year(s) : 2020 Location : ASIA (North East)

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[Specifications] Model year: 2021 Observation window: Yes Temperature range: +10℃ to +80℃ Shelf: 1 Humidity Year(s) : 2021 Location : ASIA (North East)

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Aqueous Technologies ZDO Ultrasonic Stencil Cleaning System DOM: 9/4/2020 208V single phase Year(s) : 2020 Location : AMERICA North (USA-Canada-Mexico)

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Aqueous Technologies Trident ZDO 2013 Batch Cleaner with Closed Loop Recycling From Mil Aero Prototype facil Year(s) : 2013 Location : AMERICA North (USA-Canada-Mexico)

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Semi Auto wafer level Debonder Suitable for 200mm and 300mm Wafers. Year(s) : 2013 Location : EUROPE (Western and Northern)

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Bonder Model 7200 Year(s) : 2008 Location : EUROPE (Western and Northern)

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Three MaxumPlus Bonders upgraded by KNS from Maxum. Year(s) : 2004 Location : EUROPE (Western and Northern)

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Bump height measurement system Location : ASIA (North East)

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VINTAGE 08/2011 MR36/12 Zones Double tracks External chiller Cooling water MR36 SMEMA Top and bottom hea Year(s) : 2011 Location : EUROPE (Central and Eastern)

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meas: Therma probe Year(s) : 1997 Location : ASIA (North East)

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Oven: temperature chamber Year(s) : 2000 Location : ASIA (North East)

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Microscope autoloader only (Not including the microscope) Version: 100 MM AND 150 mm -Deinstalled to warehouse Location : AMERICA North (USA-Canada-Mexico)

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Large Area PECVD system, used for SiO and SiN process depositions Version: 150 mm Vintage: 01.06.2015 Plasmat Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

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Oxide Etcher, fitted with 4 process chambers Version: 300 mm Vintage: 01.06.2012 -Tool Vintage: Jan 2012 -Tool Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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Measurement: Thickness Year(s) : 1999 Location : ASIA (North East)

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Stepper Maker Nikon Model NSR-1755G7A Year(s) : 1990 Location : ASIA (North East)

Price : On request

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Stepper Maker Nikon Model NSR-1755i7A Year(s) : 2002 Location : ASIA (North East)

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Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier HSEB (now Unity SC) Model Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size 200 mm Fab Section Etch General Product Information Vendor Supplier LAM Model 9600 BRME Vintage 19 Year(s) : 1998 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size 300 mm Fab Section R&D General Product Information Vendor Supplier Novellus Model Novellus Vector Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)

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Observation window Yes Temperature range -60 to +150℃ Shelf 1 piece Cable hole Φ50mm x 1 location (right side Year(s) : 2018 Location : ASIA (North East)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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