Micro Point Pro Ibond 5000 Ball Bonder

The iBond5000-Ball is an advanced ball bonder used for process development,
production, research, or added manufacturing support, iBond5000 provides the
high yield and excellent repeatability needed for every wedge bonding application
including Optoelectronic Modules, Hybrids/MCMs, Microwave Products,
Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors,
High Power Devices and much more..

Features:
• 7” TFT Touch Screen Management
• Cortex A9 Dual Core CPU based hardware system
• Windows CE based management software
• USB connectivity - External Mouse, Keyboard, Disk on Key
• Load/Store wire bonding profiles, Disk on Key backup
• 800MB Capacity
• K&S Bonding profiles internal library
• On-Line Manual
• Analog Pots Kit Optional
• Internal Tools database
• Semi-automatic/manual mode with Z option
• Consistent ball size via Negative Electronic Flame-Off
• Missing ball detection and auto-stop
• Large 6” x 6” bonding area
• Consistent tail length with fine adjustment on operator panel
• Deep access capability
• Z axis DC servo motion with closed loop control
• Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer
• Built-in temperature controller
• Various microscope and spotlight targeting options available
• Variety of wire types: Gold and Copper (with Copper kit option)
• Chessman/Mouse & Manual Z convertible Right or Left
• Ball bonding, Bumping, Coining, Security Bond and Tab