West Bond 454647E-79 Semiautomatic Convertible Ball Wire Bonder

WEST BOND 454647E-79 Semiautomatic Convertible Ball Wire Bonder
Microprocessor controlled motor drives for both Y and Z-axes bond a
succession of parallel, single or multiple arched wires maintaining identical loop
and bond shapes.

Unlimited deep-reach access to bond targets on IC packages of
any X-Y dimension with West•Bond’s throatless chassis and micromanipulator designs.
Ideal for bonding high power, high frequency devices where identical bond
and loop shapes are critical.Bonder comes with only a ball bonding head.
All machine configuration constants and bonding parameters are
programmable at the machine panel.
LCD display.
Heated work holder with digital display.
Three axis micromanipulator with entire mechanism above the work plane.
115V, 50/60 Hz, 6A.