Used CVD Equipment
240 resultsBrand: Questor Technology TISI ID 11241 Manufacturer Questor Technology Model APT-5800i Description TEOS Location : ASIA (North East)
Price : On request
More detailsTISI ID 150815-55 Manufacturer AMAT Model P5000 CVD Description DxL / 2C/H Wafer Size 8" Location : ASIA (North East)
Price : On request
More detailsTISI ID 20151106-30 Manufacturer Applied Materials Model Centura Universal SA-CVD Description SA-CVD Wafer Location : ASIA (North East)
Price : On request
More detailsTISI ID 150910-23 Manufacturer TEL Model α-808SC Description LP-CVD(Nitride) Wafer Size 200mm Location : ASIA (North East)
Price : On request
More detailsMetal Wafer Size 12" Year(s) : 2001 Location : ASIA (North East)
Price : On request
More detailsP-CVD(E-10) Year(s) : 1999 Location : ASIA (North East)
Price : On request
More detailsVertical LPCVD Furnace Location : ASIA (North East)
Price : On request
More detailsNitride, DxL, / 4C/H Wafer Size 8" Year(s) : 1998 Location : ASIA (North East)
Price : On request
More detailsSputtering device Year(s) : 2009 Location : ASIA (North East)
Price : On request
More detailsSputtering system wth load lock Location : ASIA (North East)
Price : On request
More detailsDxL / 4C/H Wafer Size 8" Location : ASIA (North East)
Price : On request
More detailsTEOS / 2C/H Wafer Size 8" Location : ASIA (North East)
Price : On request
More detailsTEOS / 3C/H Wafer Size 6" Location : ASIA (North East)
Price : On request
More detailsCVD DxL Nitride / 4C/H Location : ASIA (North East)
Price : On request
More detailsMOCVD Year(s) : 2008 Location : ASIA (North East)
Price : On request
More detailsNitride Wafer Size 8" Year(s) : 1991 Location : ASIA (North East)
Price : On request
More detailsDxL / 2Ch Wafer Size 6" Year(s) : 1995 Location : ASIA (North East)
Price : On request
More detailsCVD Ti&CVD TIN Wafer Size 200mm Location : ASIA (North East)
Price : On request
More detailsDelta Teos / 3Ch Wafer Size 6" Year(s) : 1995 Location : ASIA (North East)
Price : On request
More detailsDelta TEOS DxL / 3C/H Wafer Size 8" Year(s) : 1998 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBrand: JPEL P-CVD Lead Time Immediately Year(s) : 1999 Location : ASIA (North East)
Price : On request
More detailsDxL Wafer Size 8" Location : ASIA (North East)
Price : On request
More detailsVertical Furnace for LPCVD SOD Process Version: 200 mm Vintage: 01.06.2007 Vintage 2007.01 Software OS L Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSputtering System 2400 – 8L Load Lock Sputter Deposition Coater Comes with AE MDX 1K RF Power Generator Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details8 inch substrate. Manual load/unload. Vacuum function. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used CVD Equipment on Wotol
The main manufacturers of CVD Equipment are AMAT, TEL, Applied Materials, Plasmatherm, Novellus, Aixtron, Oxford, ASM, Kokusai, Varian, Anelva, CVC Products, Canon, CVC, Aixtron, Anatech, Applied, Centrotherm, DNS, Emitech, ESC, First, Hitachi, Industrial, J.C. Schumacher, Jusung Engineering, Kas, Kokusai, Lam Research, Leybold, Matheisson, Mattson, MRC, Novellus, Novellus Systems, Oxford Instruments, Perkin Elmer, SVG, Technica, TEL, Tempress, Tepla, Thomas Swan, Ulvac, Unaxis, Varian, Veeco, Watkins Johnson
The main model P5000Series, Quixace, UltimaX, OCEAN, PXJ-200, C1 TEOS, A412, Eagle XP8, IDC S6961, C-7100GT, K950, 790Series, SLR 730, 643, 7300, 2400-SSA, 601, PT530, Plasmalab 800Series, Raider ECD210 / R310PD23SRD6CFD06AY03, LT-210C 2-2-1, 5000, ATS-15 TLC ABU/TLC, ILC-1012, SRH820, SV-9040-T14, I-2300SRE, APT4800, P-5000, TC2300, SJF-1000, 80B, Eagle-10, ALPHA-303i, L-430S-FHL, VDS-5600, SPEED C2, Endura 5500, SLR-770, NGP1000, TS-81003, Eureka 2000, Ultima X, PEIIA, 1500, 999R, Z-550, SE APF, AMP-3300, ET 3000, Concept-1 200, SC-W60A-AVFG
HS Code 8486 30 21 for Chemical Vapour Deposition (CVD) equipment
HS Code 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories.