EVG 560 Bonding System

- Fully automated operation
- Interlocked doors with signal light tower
- 4 Axis Industrial Robot
- EVG CIM Framework Software GUI (Graphical User Interface)
- Flexible process flow definition
- Drag and drop recipe programming
- Parallel processing of multiple jobs
- Automated recording of process and machine parameters
- Throughput optimized handling sequence
- Password protected user access levels
- FOUP loading with empty/present sensor
- Currently configured for 8" (200mm) wafers
- Bond chuck included for 8" wafers, additional chucks can be offered
- Mechanical Alignment Module
- 1 Bond module with up to 550°C
- 1 UV Cure Bond module
- 1 Inline inspection metrology tool
- CE Certified
- System documentation