EVG 520IS Wafer Bonder

EVG 520IS Wafer Bonder consisting of:
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding (optional)
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 8"/200mm capable
- Max Bond Force: 10 kN (20kN upgrade available upon request)
- Top side heater: 550°C max. in 1°C steps
- Bottom side heater: 550°C max. in 1°C steps
- Chiller
- Temperature uniformity: ± 1,5 %
- Turbo pump and controller
- Roughing pump
- Vintage 2009
- System computer, monitor, and keyboard
- PDF Operations Manual for EVG 520IS Bonder
- Available for full inspection and demonstration
- Installation, training, service and support available worldwide!

Condition: Refurbished
Excellent Condition Guaranteed.
Fully Refurbished to Factory Specifications by ClassOne.
6 Month Warranty and Full Specifications Guarantee.
30 Day Right of Return.