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Used Bonder

326 results
1

Power Supply : 230 VAC Power Consumption : 2,3 KVA Exterior Dimensions Width 48.228 in (122.5 cm) Hei Year(s) : 2010 Location : EUROPE (Western and Northern)

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The Model 572 sets the industry standard for ease of operation and maintenance. Front panel operator controls Location : AMERICA North (USA-Canada-Mexico)

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HYBOND’s Model 616 ultrasonic single channel peg bonder has been designed to perform ultrasonic attachment of Location : AMERICA North (USA-Canada-Mexico)

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Sigma is the most advanced bond tester. Sensor accuracy and a future proof, modular design. The Revolving M Location : AMERICA North (USA-Canada-Mexico)

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The K&S 4123 is a manual wedge bonder that comes with stereo zoom optics. Upgrade to heated work holder. Location : AMERICA North (USA-Canada-Mexico)

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Accessories Heated/vacuum work stage 5.25" X 5.75" with model 1201D power supply (see photo #10) Tool heat Location : AMERICA North (USA-Canada-Mexico)

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4″ probe station 4″ chuck, 4×4″ travel Includes: Microzoom and 2 objectives 80-160x and 250-500x Location : AMERICA North (USA-Canada-Mexico)

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ELECTROGLAS 2001X PROBER MANUAL LOAD WITH 6″ CHUCK FOR UP TO 6″ WAFERS. Location : AMERICA North (USA-Canada-Mexico)

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Other Information The 4500B is a single tool with 45 degree wire feed designed to bond aluminum or gold wire Location : AMERICA North (USA-Canada-Mexico)

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Condition Very Good Exterior Dimensions Width 21.000 in (53.3 cm) Depth 21.000 in (53.3 cm) Hei Location : AMERICA North (USA-Canada-Mexico)

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DIE BONDER Year(s) : 2011 Location : EUROPE (Western and Northern)

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This West-Bond 7367A Eutectic Tweezer Bonder, Workholder and Digital Controller looks to be in good cosmetic Location : EUROPE (Western and Northern)

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This West-Bond 7316C Motorized Scrub Single Collet Eutectic Die Bonder looks to be in good cosmetic conditio Location : EUROPE (Western and Northern)

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This Mech-El MEI Marpet 1204B Manual Gold Ball Wire Bonder with Ball Bump Option looks to be in good cosmetic Location : EUROPE (Western and Northern)

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Vintage : AUG 2008 100/115V Kulicke and Soffa ICONN Wire Bonder is a High-performance wire bonding machine. Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)

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Dual Head Year(s) : 2014 Location : EUROPE (Western and Northern)

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This Orthodyne 20R Ultrasonic Ribbon Wire Bonder looks to be in good cosmetic condition, showing some minor Year(s) : 2011 Location : EUROPE (Western and Northern)

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Fine shape measuring machine Location : ASIA (North East)

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Description Automatic Wedge Bonder Other Information Programmable LCD display Wire: Aluminum and gold (18- Location : AMERICA North (USA-Canada-Mexico)

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Manual Wedge Wire Bonder, with Block AIM 10/5 Transformer Powers on and initialises. The hot plate heats up. Year(s) : 2000 Location : EUROPE (Western and Northern)

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Fully Operational 4 Axis Rotary Bondhead Wedge-Wedge Bonder with Standard X & Y axis Table, Working Area 305m Year(s) : 2009 Location : EUROPE (Western and Northern)

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PRODUCTION PATTERN PROBE STATION Location : AMERICA North (USA-Canada-Mexico)

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S1000 3″ PROBE STATION Includes B&L Stereo Zoom 4 Optics Location : AMERICA North (USA-Canada-Mexico)

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PROBES UP TO 200mm OR 8″ WAFERS. AVAILABLE WITH STEREO ZOOM OPTICS OR HIGH POWER MICROSCOPES (MICROZOOM OR MIT Location : AMERICA North (USA-Canada-Mexico)

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VERTICAL FEED WEDGE BONDER INCLUDES STEREO ZOOM OPTICS good condition Location : EUROPE (Western and Northern)

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You can find used Bonder on Wotol

The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .

The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT,  572-40, DXB,  505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.

HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays

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