Used Bonder
320 resultsVintage : AUG 2008 100/115V Kulicke and Soffa ICONN Wire Bonder is a High-performance wire bonding machine. Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsVintage : DEC 2010 100/115V Specifications Kulicke and Soffa ICONN Wire Bonder is a High-performance wire b Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
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More detailsBrand: Palomar Palomar Hughes 2460-V Automatic Thermosonic Hybrid Gold Ball Bonder With heated work stage, M Location : AMERICA North (USA-Canada-Mexico)
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More detailsBESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder High accuracy and high productivity Less than 100 operat Location : AMERICA North (USA-Canada-Mexico)
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More detailsCondition: Excellent; used in clean room only! Standard X/Y table work area: 12.3" x 7" 2" Wire Spool, motoriz Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
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More detailsWIRE PULL TEST MACHINE Location : ASIA (North East)
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More detailsMulti-Chip Die Bonder Condition Very Good Year of Manufacture 2007 Year(s) : 2007 Location : EUROPE (Western and Northern)
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More detailsAutomated Debonding System Serial : S120080 Location : AMERICA North (USA-Canada-Mexico)
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More detailsAutomated Debonding System Location : AMERICA North (USA-Canada-Mexico)
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More detailsAutomated Production Bonding System Location : AMERICA North (USA-Canada-Mexico)
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More detailsAutomated Production Bonding System serial number 85080126 Location : AMERICA North (USA-Canada-Mexico)
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More detailsMachine come with flip-chip configuration which you could review from the attached photos. Year(s) : 2023 Location : EUROPE (Western and Northern)
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More detailsEVG EV501 WAFER BONDER consisting of: - Model: EVG 501 - Capable of thermo compression, fusion or anodic waf Location : AMERICA North (USA-Canada-Mexico)
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More detailsThe MEl 829Z is a thermosonic ball bonder with manual Z lever and heated work holder. Location : AMERICA North (USA-Canada-Mexico)
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More details- Wafer Size: Small Pieces up to 6”/150mm Diameter Wafers - Topside (TSA) Alignment - Suss DVM6 Microscope - Location : AMERICA North (USA-Canada-Mexico)
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More detailsManual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bondin Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
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More detailsManual wafer load substrate bonder Set up for fusion compression bonding, thermal compression bonding, and an Location : AMERICA North (USA-Canada-Mexico)
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More detailsFEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)
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More details552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)
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More details572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)
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More details7372E Convertible Epoxy/Eutectic Die Bonder. Unlimited deep reach access to remote bond targets on large packa Location : AMERICA North (USA-Canada-Mexico)
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More detailsProgrammable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digital readout Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsConvertible Epoxy/Eutectic Die Bonder. Unlimited deep reach access to remote bond targets on large packages Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsThermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axi Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details4KE Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Wire Bonder. All programmed bond v Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays