1/1
Datacon 2200 EVO 2019
Ref :
2619486-9-CP
Condition :
Used
Manufacturer :
Datacon
Model :
2200 EVO
Short Description :
2019
Year(s) :
-
Quantity :
1
Location :
Seller or machines location:
AMERICA North (USA-Canada-Mexico)
AMERICA North (USA-Canada-Mexico)
BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder
High accuracy and high productivity
Less than 100 operating hours...VERY LOW USE!
Wafer Table
Tool Changer Unit 7 Slots
Main – Musashi Super Sigma V2
Internal Vacuum Pump
P-part at Main AXIS
Microscope
Other machines similar to Datacon 2200 EVO 2019
1
Datacon 2200 APM Bonder
Location :
EUROPE (Western and Northern)
1
Datacon 2200 apm Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2007
1
Datacon 2200EVO Die Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2023
1
Shinkawa UTC1000 Wire Bonder
Location :
EUROPE (Western and Northern)
Year(s) :
2004