Used Semiconductor Equipment

- Manual Wafer Load Plasma Asher - Used for Wafer Cleaning and Descum - Can Process up to 150mm Wafers - Farad Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- 3 Dynatronix Pulse Power Supplies - Configured for 6" Wafers - Configured for: Tin, Gold, Copper - 68" Wide Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- PCT Systems Megasonic Hyperclean Controller - 2 Foot Pedals - 2 Goosenecks - 47" x 26" x 3" Parts Cleaning B Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligner - Module 2: NP200 – Plasma Ac Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Microwave Asher Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Configured for Top Side Alignment - Includes one Chuck (Customer to Choose Size) - Includes one Maskholder ( Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Single PECVD chamber, non load-locked - Input Power: 208V, 3ph - Heated Platen up to 400 C - Max Wafer Size Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Can handle from 2" up to 8"/200mm wafers - Submicron sensitivity, detects 0.2 micron particles - Surface haz Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Up to 8"/200mm wafer capable - Computer controlled - Measures roughness, waviness, step height, and other su Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Bare Wafer Surface Defect Inspection System - System can handle up to 200mm capable - Cassette Handling: Sin Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Topside Alignment (TSA) - Automatic Mask Aligner - Cassette to cassette operation - Can be used in either Au Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Wafer Size: 150mm & 200mm wafer capable - Process: DI water/ozone - Rinse: DI water with ammonium hydroxide Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Currently Configured for 200mm Wafer Handling Dual Open Cassette Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Load Locked Chamber - Carrier Plate to run batches of (qty 4) 150mm wafers per run - Carrier Plate to run b Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Semi-Automatic, with Manual loading - Suitable for wafer sizes 3" - 8" wafers (with proper chuck) - Currentl Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Semi-Automatic RF Plasma System - Can process up to 150mm wafers - Used for photoresist stripping and surfa Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Load Locked Chamber - System PC, Keyboard, Mouse - Windows 7 w/ PC4000 Software - 490mm Diameter Aluminum L Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Max Wafer: 200mm Configuration: Topside Alignment, 350W Lamphouse, UV400 Optics - Topside Alignment - 350W Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Spray Acid Tool (SAT) - Single Chamber - Up to 6"/150mm capable - Capacity: Single 25-Wafer Cassette, 150mm Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Max Wafer: 150mm Configuration: Electroplating Wet Bench, manual wafer loading, currently configured for 6 Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Single chamber with load lock - Can process up to 8"/200mm wafers - Turbo Pump - AEI/RFPP RF5S 500W RF Gener Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Up to 8"/200mm wafer handling - Allows small batch processing for R&D and Pilot Production - Load-locked Sys Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Manual Mask Aligner - Topside Alignment (TSA) - Manual Alignment - Up to 6"/150mm Wafer Capable (with proper Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Manual wafer load substrate bonder - Capable of fusion compression bonding - Capable of thermal compression Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Max Wafer: 200mm Configuration: 4 Bonding Chambers, 10 kN Pressure Bonding Capability, Up To 550°C Fully aut Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request