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Used Semiconductor and PCB Manufacturing

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- Topside Alignment (TSA) - Automatic Mask Aligner - Cassette to cassette operation - Can be used in either Au Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

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- Wafer Size: 150mm & 200mm wafer capable - Process: DI water/ozone - Rinse: DI water with ammonium hydroxide Year(s) : 2004 Location : AMERICA North (USA-Canada-Mexico)

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Currently Configured for 200mm Wafer Handling Dual Open Cassette Location : AMERICA North (USA-Canada-Mexico)

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- Load Locked Chamber - Carrier Plate to run batches of (qty 4) 150mm wafers per run - Carrier Plate to run b Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

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- Semi-Automatic, with Manual loading - Suitable for wafer sizes 3" - 8" wafers (with proper chuck) - Currentl Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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- Semi-Automatic RF Plasma System - Can process up to 150mm wafers - Used for photoresist stripping and surfa Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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- Load Locked Chamber - System PC, Keyboard, Mouse - Windows 7 w/ PC4000 Software - 490mm Diameter Aluminum L Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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- Up to 7" Mask Capability - High-pressure water jet for effective rinse - Uses non-abrasive, high-pressure j Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 200mm Configuration: Topside Alignment, 350W Lamphouse, UV400 Optics - Topside Alignment - 350W Location : AMERICA North (USA-Canada-Mexico)

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- Spray Acid Tool (SAT) - Single Chamber - Up to 6"/150mm capable - Capacity: Single 25-Wafer Cassette, 150mm Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 150mm Configuration: Electroplating Wet Bench, manual wafer loading, currently configured for 6 Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)

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- Single chamber with load lock - Can process up to 8"/200mm wafers - Turbo Pump - AEI/RFPP RF5S 500W RF Gener Location : AMERICA North (USA-Canada-Mexico)

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- Up to 8"/200mm wafer handling - Allows small batch processing for R&D and Pilot Production - Load-locked Sys Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

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- Manual Mask Aligner - Topside Alignment (TSA) - Manual Alignment - Up to 6"/150mm Wafer Capable (with proper Year(s) : 2011 Location : AMERICA North (USA-Canada-Mexico)

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- Manual wafer load substrate bonder - Capable of fusion compression bonding - Capable of thermal compression Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 200mm Configuration: 4 Bonding Chambers, 10 kN Pressure Bonding Capability, Up To 550°C Fully aut Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 150mm System Dimensions: 36 1/2 x24 1/2 x34 - Manual Wafer Load Mask Aligner - 500W NUV Lamphous Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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- Long Scan Surface Profilometer - Wafer Size: 8"/200mm - S/N: 1090-0420 Location : AMERICA North (USA-Canada-Mexico)

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Max Wafer: 200mm System Dimensions: 30x40x66 Weight: 695 lbs - Automatic Surface Inspection System - Bare W Location : AMERICA North (USA-Canada-Mexico)

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- Dual Function (Prime / Reversal) - Up to 200 Degrees Celsius - Chamber Dimensions 16” x 16” x 16” - 8 Heater Location : AMERICA North (USA-Canada-Mexico)

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XRX-X4 X-Ray System Location : AMERICA North (USA-Canada-Mexico)

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- Up to 8"/200mm wafer capable - Computer controlled - Measures roughness, waviness, step height, and other su Location : AMERICA North (USA-Canada-Mexico)

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Fully refurbished to like-new condition, including 1 year warranty, professional installation, and also proce Location : AMERICA North (USA-Canada-Mexico)

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<b>1x, KLA-Tencor, 2138XP Surface Inspection System</b> - Currently Setup for Processing 8"/200mm Wafers - L Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size 8" Vintage - . Scans samples up to 8 inch . Little or no sample preparation for increased produc Location : ASIA (North East)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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