Used Bonder
320 resultsMA200CC Main System Automatic Mask Aligner Configured for Top Side Alignment Cassette to Cassette Operation Up Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- Wafer Substrate Bonder - Single Station Wafer Bonder - Used For temporary Wax Mounting of Semiconductor Wafe Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details- Windows based with Suss AL 900 / Autoalign System - Alignment System MA200e TSA - PC -Aut. Adjustment ( Cog Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMax Wafer: 100mm System Dimensions: main unit 24x42x27 Configuration: 4"/100mm Wafers Max, Topside Align Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)
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More details- PC, Monitor, Keyboard, Mouse - 1000W Lamphouse - Power Supply - Isolation Table - Chuck and Maskholder for Year(s) : 2010 Location : AMERICA North (USA-Canada-Mexico)
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More details- PC & Monitor - Keyboard and Mouse Location : AMERICA North (USA-Canada-Mexico)
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More details- Microscope - PC & Monitor - Mouse and Keyboard Location : AMERICA North (USA-Canada-Mexico)
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More details- Leica S6 Microscope - BS5kg Bondtester Shear Load Cell Cartridge - PC & Monitor - Mouse and Keyboard - Ion G Location : AMERICA North (USA-Canada-Mexico)
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More details- PC & Monitor - Keyboard and Mouse Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)
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More details- Leica S6 Microscope - PC & Monitor - Mouse and Keyboard Location : AMERICA North (USA-Canada-Mexico)
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More detailsConfiguration: Fully Automatic Dicing Saw Year(s) : 2009 Location : AMERICA North (USA-Canada-Mexico)
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More details- Powervar Security Plus Uninterruptible Power Supply - PC & Monitor - Keyboard and Mouse Location : AMERICA North (USA-Canada-Mexico)
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More details- MHU - Main Handling Unit w/ Genmark GB8 Robot - Module 1: BA200 – Bond Aligner - Module 2: NP200 – Plasma Ac Location : AMERICA North (USA-Canada-Mexico)
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More details- Manual wafer load substrate bonder - Capable of fusion compression bonding - Capable of thermal compression Location : AMERICA North (USA-Canada-Mexico)
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More detailsMax Wafer: 200mm Configuration: 4 Bonding Chambers, 10 kN Pressure Bonding Capability, Up To 550°C Fully aut Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)
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More detailsMax Wafer: 150mm System Dimensions: 36 1/2 x24 1/2 x34 - Manual Wafer Load Mask Aligner - 500W NUV Lamphous Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)
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More detailsXRX-X4 X-Ray System Location : AMERICA North (USA-Canada-Mexico)
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More detailsworking condition standard configuration Location : ASIA (China - Taiwan - HKG)
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More detailswafer size: 200mm excellent working condition Year(s) : 2017 Location : ASIA (China - Taiwan - HKG)
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More detailsDie Bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsGold Ball Bonder Location : AMERICA North (USA-Canada-Mexico)
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More detailsWestbond 7400 Wedge Bonder with Heated Workholder & Optics Location : AMERICA North (USA-Canada-Mexico)
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More detailsOrthodyne 20 Wedge Bonder with Workholder & Optics Capable of using wire up to 20 mil Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMech El 909 Wedge Bonder with Workholder & Optics Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsK&S 472 Ball Bonder with Heated Workholder & Optics Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsYou can find used Bonder on Wotol
The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .
The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT, 572-40, DXB, 505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.
HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays