Used Bonder

UTC2000 Copper Wire Bonder Location : EUROPE (Western and Northern)

Price : On request

Complete and in working condition Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

excellent condition, very very few hours of use in a R&D lab. Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

2008HS3 Plus Die Bonder Location : EUROPE (Western and Northern)

Price : On request

Die Sorter Bonder Location : EUROPE (Western and Northern)

Price : On request

ASM AD9012 FLIPCHIP 12″ D/A 10 Sets Available Year(s) : 2007 Location : EUROPE (Western and Northern)

Price : On request

Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Motorized Y axis a Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Automatic Wedge Bonder Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Convertible Bonder , Wedge to Ball Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Method: Thermosonic connection of spheroidal wedges Au wire diameter: 18 - 50 µm Diameter of the spool: 5,08 c Location : EUROPE (Western and Northern)

Price : On request

Bond Tester Control Box Includes Control Board and Connecting Cable Condition Excellent Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Specs: Wire Diameter Range : Gold - 0.5 to 3.0 mils (12.7 to 76.2 µm) Aluminum - 1.0 to 3.0 mils (25.4 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Manual Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Bonder sn 14691 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

STM-50K shear (50KG) RPTM-2K rotary bond pull (2KG) RPTM-50 rotary bond pull (50gr) Location : AMERICA North (USA-Canada-Mexico)

Price : On request

gold ball bonder with heated workholder Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wire sizes: Â 1 mil (25 micron) wire standard. Â 0.7 mil (18 micron), 2 mil (51 micron), and 3 mil (76 micron) Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Specification: Exposition mode: Manual, semi-automatic of fully automatic Dimensions of the table: 100 mm x 1 Location : EUROPE (Central and Eastern)

Price : On request

Specification: Dimensions of the table: 100 mm x 100 mm Height adjustability: 50 mm (max) Range of contact an Location : EUROPE (Central and Eastern)

Price : On request

Specification: Au wire diameter: 12,7µm (min) - 76µm (max) Al wire diameter: 20µm (min) - 76µm (max) Bonding f Location : EUROPE (Central and Eastern)

Price : On request

4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or ad Location : AMERICA North (USA-Canada-Mexico)

Price : On request

4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discre Location : AMERICA North (USA-Canada-Mexico)

Price : On request

7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wedge Wire Bonder Bonds gold wires ranging from 0.0007” to 0.0 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

MA200CC Main System Automatic Mask Aligner Configured for Top Side Alignment Cassette to Cassette Operation Up Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

- Wafer Substrate Bonder - Single Station Wafer Bonder - Used For temporary Wax Mounting of Semiconductor Wafe Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

Price : On request