EVG 520 Wafer Bonder

- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 150mm capable
- Max Bond Force: 20 kN
- Top side heater: 550°C max. in 1°C steps
- Bottom side heater: 550°C max. in 1°C steps
- Chiller
- Temperature uniformity: ± 1,5 %
- Turbo pump and controller
- Roughing pump
- Load/unload tool
- System computer, monitor, and keyboard